Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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12 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame				Die Attach			Plating		Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-22-4	7439-89-6	7440-50-8	n/a	129915-35-1	1344-28-1	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCP6922C	NCP6922CBMTTXG	Obsolete	Y	No data available
NCP6922C	NCP6922CCMTTXG	Obsolete	Y	No data available
NCP6922C	NCP6922CDMTTXG	Obsolete	Y	No data available
NCP6924	NCP6924AFCET1G	Obsolete	Y	No data available
NCP6924	NCP6924AFCHT1G	Obsolete	Y	No data available
NCP6924	NCP6924BFCHT1G	Obsolete	Y	No data available
NCP6924	NCP6924CFCHT1G	Obsolete	Y	No data available
NCP6924	NCP6924FFCHT1G	Obsolete	Y	No data available
NCP6925	NCP6925AFCT1G	Obsolete	Y	No data available
NCP6925	NCP6925AFCT2G	Obsolete	Y	No data available
NCP6925	NCP6925BFCCT2G	Obsolete	Y	No data available
NCP692	NCP692MN33T2G	Active	Y	7.00	7.00	15.00	0.50	70.50	14.2500	2.00	2.20	95.80	2.7800	32.00	68.00	0.1800	100.00	1.2200	100.00	1.0700	100.00	0.2100	19.7100

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.