Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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15 Non-hybrid devices found
Non-hybrid devices
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Mold Compound-Black
Lead Frame
Die Attach
Plating
Die
Wire Bond - Au
TOTAL
Epoxy resin [%]
Epoxy and Phenolic Resin [%]
Phenolic Resin [%]
Ortho Cresol Novolac Resin [%]
Epoxy Phenol Resin [%]
Silica Amorphous (SiO2) [%]
Carbon Black (C) [%]
Aluminum Hydroxide (Al(OH)3) [%]
Fused Silica (SiO2) [%]
Phenolic Resin (Novolac) [%]
Weight [mg]
Silver (Ag) [%]
Tin (Sn) [%]
Zinc (Zn) [%]
Chromium (Cr) [%]
Iron (Fe) [%]
Copper (Cu) [%]
Phosphorus (P) [%]
Weight [mg]
Epoxy resin [%]
Fatty acids, C18-unsatd., dimers, polymers with epichlorhydrin [%]
2,6-DiglycidylPhenylGlycidylEther [%]
4-Methyl-2-Phenyl-1H-Imidazole [%]
Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]
Silver (Ag) [%]
Epoxy resins [%]
Aluminum Trioxide (Al2O3) [%]
Antimony Pentoxide (Sb2O5) [%]
Phenolic Resin (Novolac) [%]
Weight [mg]
Tin (Sn) [%]
Weight [mg]
Silicon (Si) [%]
Weight [mg]
Gold (Au) [%]
Weight [mg]
Weight [mg]
proprietary data
40216-08-8
proprietary data
29690-82-2
proprietary data
7631-86-9
1333-86-4
21645-51-2
60676-86-0
9003-35-4
n/a
7440-22-4
7440-31-5
7440-66-6
7440-47-3
7439-89-6
7440-50-8
7723-14-0
n/a
proprietary data
68475-94-5
13561-08-5
827-43-0
129915-35-1
7440-22-4
129915-35-1
1344-28-1
1314-60-9
9003-35-4
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP4306
NCP4306AAAZZZADR2G
Active
Y
5.00
2.00
5.00
0.50
87.50
28.5800
0.30
0.19
2.59
96.78
0.14
37.6100
75.00
25.00
2.4000
100.00
1.8900
100.00
1.3300
100.00
0.1900
72.0000
NCP4306
NCP4306AAAZZZAMN1TBG
Active
Y
8.00
0.50
2.00
86.50
3.00
5.6800
4.60
0.25
0.22
0.25
94.68
5.0000
75.00
25.00
0.1700
100.00
0.2400
100.00
1.1600
100.00
0.0700
12.3200
NCP4306
NCP4306AAAZZZAMNTWG
Active
Y
7.00
7.00
15.00
0.50
70.50
20.0000
19.60
0.80
79.60
14.9400
75.00
25.00
0.9500
100.00
1.1100
100.00
0.4000
100.00
2.6000
40.0000
NCP4306
NCP4306AADZZZADR2G
Active
Y
5.00
2.00
5.00
0.50
87.50
28.5800
0.30
0.19
2.59
96.78
0.14
37.6100
75.00
25.00
2.4000
100.00
1.8900
100.00
1.3300
100.00
0.1900
72.0000
NCP4306
NCP4306AADZZZAMN1TBG
Active
Y
8.00
0.50
2.00
86.50
3.00
5.6800
4.60
0.25
0.22
0.25
94.68
5.0000
75.00
25.00
0.1700
100.00
0.2400
100.00
1.1600
100.00
0.0700
12.3200
NCP4306
NCP4306AADZZZAMNTWG
Active
Y
7.00
7.00
15.00
0.50
70.50
20.0000
19.60
0.80
79.60
14.9400
75.00
25.00
0.9500
100.00
1.1100
100.00
0.4000
100.00
2.6000
40.0000
NCP4306AAGZZZADR2G
Obsolete
Y
No data available
NCP4306
NCP4306AAHZZZADR2G
Active
Y
5.00
2.00
5.00
0.50
87.50
28.5800
0.30
0.19
2.59
96.78
0.14
37.6100
75.00
25.00
2.4000
100.00
1.8900
100.00
1.3300
100.00
0.1900
72.0000
NCP4306BAGZJZASNT1G
Obsolete
Y
No data available
NCP4306BAHZJZASNT1G
Obsolete
Y
5.00
2.00
5.00
0.50
87.50
7.3300
1.22
0.12
2.35
96.28
0.03
5.8400
32.00
68.00
0.0700
100.00
0.4700
100.00
0.4200
100.00
0.0700
14.2000
NCP4306CADGZZASNT1G
Obsolete
Y
No data available
NCP4306CADJZZASNT1G
Obsolete
Y
5.00
2.00
5.00
0.50
87.50
7.3300
1.22
0.12
2.35
96.28
0.03
5.8400
32.00
68.00
0.0700
100.00
0.4700
100.00
0.4200
100.00
0.0700
14.2000
NCP4306
NCP4306DADZZBASNT1G
Active
Y
No data available
NCP4306
NCP4306DADZZDASNT1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3300
1.22
0.12
2.35
96.28
0.03
5.8400
30.00
30.00
30.00
9.00
1.00
0.0700
100.00
0.4700
100.00
0.4200
100.00
0.0700
14.2000
NCP4306
NCP4306DAHZZAASNT1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3300
1.22
0.12
2.35
96.28
0.03
5.8400
32.00
66.80
1.20
0.0700
100.00
0.4700
100.00
0.4200
100.00
0.0700
14.2000
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .