Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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5 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame										Die Attach							Plating		Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Epoxy Phenol Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Isobornyl Methacrylate [%]	Silver (Ag) [%]	Epoxy resins [%]	Isobornyl Acrylate [%]	Misc. [%]	Tricyclo[5.2.1.02,6]decanedimethanol Diacrylate (C18H24O4) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	9003-35-4	n/a	7440-22-4	7439-95-4	7440-31-5	7440-66-6	7440-47-3	7440-21-3	7440-02-0	7439-89-6	7440-50-8	n/a	7534-94-3	7440-22-4	129915-35-1	5888-33-5	proprietary data	42594-17-2	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NBC12429	NBC12429AFNR2G	Lifetime	Y	7.00	7.00		15.00	0.50	70.50		782.4400	1.20			0.20				2.60	96.00	253.8600		75.00	25.00				16.2000	100.00	19.8300	100.00	6.5200	100.00	1.1600	1,080.0100
NBC12429	NBC12429AMNR4G	Active	Y	4.70			10.00	0.10	80.50	4.70	37.0000	1.00		0.25	0.22	0.25				98.28	33.6000	6.00	81.50		6.00	0.50	6.00	0.3700	100.00	1.3000	100.00	1.6700	100.00	0.3600	74.3000
NBC12429	NBC12429FAG	Active	Y			10.50			89.50		114.2400	0.30	0.10				0.70	3.00		95.90	49.9900		75.00	25.00				3.1900	100.00	6.7000	100.00	0.3300	100.00	0.6500	175.1000
NBC12429	NBC12429FAR2G	Active	Y			10.50			89.50		114.2400	0.30	0.10				0.70	3.00		95.90	49.9900		75.00	25.00				3.1900	100.00	6.7000	100.00	0.3300	100.00	0.6500	175.1000
NBC12429	NBC12429FNR2G	Lifetime	Y	7.00	7.00		15.00	0.50	70.50		782.4400	1.20			0.20				2.60	96.00	253.8600		75.00	25.00				16.2000	100.00	19.8300	100.00	6.5200	100.00	1.1600	1,080.0100

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices