Material Composition

Locate Pb‑free (RoHS), IMDS, and Halogen‑free material content details.

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Material Composition (Selected Parts)

3  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Material Composition Declaration (MCD)  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   Backside Protection Film   Protection coat   RDL Sputter   Solder Ball   UBM/RDL PCu   UBM Sputter   TOTAL 
4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Weight
[mg]
Epoxy resin
[%]
Silver (Ag)
[%]
Acrylic resin
[%]
Aluminum (Al)
[%]
Weight
[mg]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Epoxy resin
[%]
Carbon Black (C)
[%]
Acrylic resin
[%]
Silica (SiO2)
[%]
Weight
[mg]
Polyimide
[%]
Weight
[mg]
Titanium (Ti)
[%]
Copper (Cu)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Titanium (Ti)
[%]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
Excel IPC1752 PDF IPC175X XML IPC1752A XML 85954-11-6 1333-86-4 60676-86-0 9003-35-4 n/a 7440-66-6 7439-89-6 7440-50-8 n/a proprietary data 7440-22-4 proprietary data 7429-90-5 n/a 7440-05-3 7440-02-0 7440-57-5 n/a 7440-21-3 n/a 7440-57-5 n/a proprietary data 1333-86-4 proprietary data 14464-46-1 n/a proprietary data n/a 7440-32-6 7440-50-8 n/a 7440-22-4 7440-31-5 7440-50-8 n/a 7440-50-8 n/a 7440-32-6 7440-50-8 n/a n/a
N34TS108 N34TS108C6ECT5G Active  Y   Download xls Download xml Download xml Download xml                                                        100.00   0.6700         20.93   1.84   20.93   56.30   0.0360   100.00   0.0170   11.20   88.80   0.0018   4.00   95.50   0.50   0.1440   100.00   0.0607   11.20   88.80   0.0004   0.9300 
  N34TS108C6EXT5G Consult Sales Office  Y           No data available
N34TS108 N34TS108MUET3G Active  Y   Download xls Download xml Download xml Download xml  4.50   0.50   92.00   3.00   2.8720   0.12   2.26   97.62   3.3190   13.00   35.00   17.00   35.00   0.1080   8.97   89.74   1.28   0.0780   100.00   0.3770   100.00   0.0500                                                            6.8040 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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