Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

3 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 3 of 3

Base part	Part	Status	HF	Mold Compound-Black					Lead Frame				Die Attach					Plating				Die		Wire Bond - Au		Backside Protection Film					Protection coat		RDL Sputter			Solder Ball				UBM/RDL PCu		UBM Sputter			TOTAL
				4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Acrylic resins [%]	Aluminum (Al) [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Epoxy resin [%]	Carbon Black (C) [%]	Acrylic resins [%]	Silica (SiO2) [%]	Weight [mg]	Polyimide [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				85954-11-6	1333-86-4	60676-86-0	9003-35-4	n/a	7440-66-6	7439-89-6	7440-50-8	n/a	proprietary data	7440-22-4	proprietary data	7429-90-5	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	proprietary data	1333-86-4	proprietary data	14464-46-1	n/a	proprietary data	n/a	7440-32-6	7440-50-8	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-50-8	n/a	7440-32-6	7440-50-8	n/a	n/a
N34TS108	N34TS108C6ECT5G	Active	Y																			100	0.67			20.93	1.84	20.93	56.3	0.036	100	0.017	11.2	88.8	0.00184	4	95.5	0.5	0.144	100	0.06073	11.2	88.8	4.3E-4	0.93
	N34TS108C6EXT5G	Consult Sales Office	Y	No data available
N34TS108	N34TS108MUET3G	Active	Y	4.5	0.5	92	3	2.872	0.120518	2.25972	97.6198	3.319	13	35	17	35	0.108	8.97436	89.7436	1.28205	0.078	100	0.377	100	0.05																				6.804

Page size:

1 - 3 of 3

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.