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Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Sort by entry order
Search OPNs only
          Download:  Download xls  Excel 

Use~for the exact search match (i.e. ~NTS2101PT1).

7  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%]
Phenolic Resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Ortho Cresol Novolac Resin
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Silver (Ag)
[%]
Phenolic Resin-2
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data proprietary data 7631-86-9 1333-86-4 60676-86-0 29690-82-2 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a 7440-22-4 54208-63-8 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
FSL518 FSL518APG Active  Y   Download xls Download xml Download xml Download xml  7.00   2.50   7.50   0.50   80.00   2.50   321.0000   0.50   0.14   2.61   96.53   0.22   121.2000   75.00   25.00   3.0000   100.00   9.0500   100.00   1.6000   100.00   6.0000   461.8500 
FSL518 FSL518APLR2G Product Preview  Y           No data available
FSL518 FSL518HPG Active  Y   Download xls Download xml Download xml Download xml  7.00   2.50   7.50   0.50   80.00   2.50   321.0000   0.50   0.14   2.61   96.53   0.22   121.2000   75.00   25.00   3.0000   100.00   9.0500   100.00   1.6000   100.00   6.0000   461.8500 
FSL518 FSL518HPLR2G Product Preview  Y           No data available
  FSL518HRLX Obsolete  Y           No data available
  FSL518HRMX Obsolete  Y           No data available
  FSL518HRN Obsolete  Y           No data available
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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