Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame								Die Attach					Plating				Die		Wire Bond - Au		Protection coat		RDL Sputter			Solder Ball				UBM/RDL PCu		UBM Sputter			TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Magnesium (Mg) [%]	Zinc (Zn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Formaldehyde Polymer [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Polyimide [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	n/a	7439-95-4	7440-66-6	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	9003-36-5	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	proprietary data	n/a	7440-32-6	7440-50-8	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-50-8	n/a	7440-32-6	7440-50-8	n/a	n/a
CAV24C04	CAV24C04C4ATR	Active	Y																								100	0.3895			100	0.0105	20	80	4.0E-4	2.6	96.8	0.6	0.0523	100	0.0153	20	80	2.0E-4	0.4682
CAV24C04	CAV24C04C5ATR	Active	Y	No data available
CAV24C04	CAV24C04WE-GT3	Active	Y	5	5	2	0.5	87.5	46.76		0.1			2.3	97.5	0.1	27.35	10	80		10	0.21	6.22	92.71	1.07	0.34	100	2.65	100	0.15															77.46
CAV24C04	CAV24C04YE-GT3	Active	Y	5	5	2	0.5	87.5	19.21	0.15		0.65	3		96.2		10.96		75	25		0.12	6.22	92.71	1.07	0.12	100	0.66	100	0.13															31.2

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.