Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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Use~for the exact search match (i.e. ~NTS2101PT1).

15 Non-hybrid devices found

Non-hybrid devices

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1 - 15 of 15

Base part	Part	Status	HF	Die		Protection coat		RDL			Solder Ball			UBM Sputter			TOTAL
				Silicon (Si) [%]	Weight [mg]	Polyimide [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				7440-21-3	n/a	proprietary data	n/a	7440-32-6	7440-50-8	n/a	7440-22-4	7440-31-5	n/a	7440-32-6	7440-50-8	n/a	n/a
CAT24C32B	CAT24C32BAC4CTR	Active	Y	100	0.2641	100	0.0082	0.92	99.08	0.0067	2.6	97.4	0.0222	0.5	99.5	0.0067	0.3079
	CAT24C32BHU4E-GT3	Obsolete	Y	No data available
	CAT24C32BHU4I-GT3	Obsolete	Y	No data available
	CAT24C32BLE-G	Obsolete	Y	No data available
	CAT24C32BLI-G	Obsolete	Y	No data available
	CAT24C32BWE-KT3	Obsolete	Y	No data available
	CAT24C32BWI-G	Obsolete	Y	No data available
	CAT24C32BWI-GT3	Obsolete	Y	No data available
	CAT24C32BWI-K	Obsolete	Y	No data available
	CAT24C32BWI-KT3	Obsolete	Y	No data available
	CAT24C32BYE-GT3	Obsolete	Y	No data available
	CAT24C32BYE-KT3	Obsolete	Y	No data available
	CAT24C32BYI-G	Obsolete	Y	No data available
	CAT24C32BYI-GT3	Obsolete	Y	No data available
	CAT24C32BYI-KT3	Obsolete	Y	No data available

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1 - 15 of 15

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.