Material Composition

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Die Attach   Die   Wire Bond - Au   Epoxy   Imaging Lens   Mold Compound   Solder Ball   Substrate and Solder Mask   TOTAL 
Epoxy resin
[%]
4-Methylhexahydrophthalsureanhydrid
[%]
Titanium triisostearoylisopropoxide
[%]
2,2-dimethyl-1,3-propanediyl dimethacrylate
[%]
2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane
[%]
Bisphenol A_Epichlorohydrin Polymer
[%]
1,4-Bis(2,3-epoxypropoxy)butane
[%]
Isobornyl Acrylate
[%]
Aluminum Trioxide (Al2O3)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Imidazole Addition
[%]
Bisphenol A_Epichlorohydrin Polymer
[%]
Zirconium Dioxide (ZrO2)
[%]
Silica Amorphous (SiO2)
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Sulfur (S)
[%]
Titanium Dioxide (TiO2)
[%]
Sodium Monoxide (Na2O)
[%]
Boron Trioxide (B2O3)
[%]
Zinc Monoxide (ZnO)
[%]
Aluminum Trioxide (Al2O3)
[%]
Calcium Monoxide (CaO)
[%]
Potassium Monoxide (K2O)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Triphenylphosphine
[%]
Trimethoxysilylpropanethiol
[%]
Oxirane
[%]
Silica Amorphous (SiO2)
[%]
Misc.
[%]
Fused Silica (SiO2)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Epoxy resin
[%]
Phosphinoxide Derivative
[%]
4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl
[%]
Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2)
[%]
Fused Silica (SiO2)
[%]
Barium Sulfate (BaSO4)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 19438-60-9 61417-49-0 1985-51-9 3388-04-3 25068-38-6 2425-79-8 5888-33-5 1344-28-1 n/a 7440-21-3 n/a 7440-57-5 n/a 68490-66-4 25068-38-6 1314-23-4 7631-86-9 9003-36-5 n/a 7704-34-9 13463-67-7 1313-59-3 1303-86-2 1314-13-2 1344-28-1 1305-78-8 12136-45-7 14808-60-7 n/a 603-35-0 4420-74-0 39817-09-9 7631-86-9 proprietary data 60676-86-0 14808-60-7 n/a 7440-22-4 7440-31-5 7440-50-8 n/a proprietary data proprietary data 85954-11-6 14807-96-6 60676-86-0 7727-43-7 n/a n/a
AS0140AT AS0140AT2C00XUSM0-DRBR-E Obsolete  Y           No data available
AS0140AT AS0140AT2C00XUSM0-TPBR Last Shipments  Y   Download xls Download xml Download xml Download xml  5.00   0.50   5.00   5.00   5.00   0.50   5.00   5.00   69.00   1.1500   100.00   19.8200   100.00   0.2400   30.00   10.00   10.00   10.00   40.00   1.0800   0.50   5.40   5.50   5.40   5.40   5.40   0.50   5.40   66.50   29.9000   0.50   0.50   20.00   20.00   5.00   49.00   5.00   31.5200   3.00   96.50   0.50   44.2000   75.50   1.50   2.00   1.50   16.50   3.00   65.9800   193.8900 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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