Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame						Die Attach					Plating					Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	9003-36-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCS20092	NCS20092DMR2G	Active	Y	5.00	5.00	2.00		0.50	87.50	14.9600	2.50	0.10	2.40	95.00		14.2600		75.00	25.00		0.9100	100.00				0.3800	100.00	0.3100	100.00	0.3000	31.1200
NCS20092	NCS20092DR2G	Active	Y	5.00	2.00	2.50		0.50	90.00	29.7700	2.14	0.13	2.40	95.25	0.08	37.6100	10.00	80.00		10.00	0.1000	100.00				1.8900	100.00	0.1700	100.00	0.1900	69.7300
NCS20092	NCS20092DTBR2G	Active	Y				10.50		89.50	9.5000			1.90	98.10		10.3800		75.00	25.00		0.6600	100.00				1.0600	100.00	1.0000	100.00	0.1000	22.7000
NCS20092	NCV20092DMR2G	Active	Y	5.00	5.00	2.00		0.50	87.50	14.9600	2.50	0.10	2.40	95.00		14.2600		75.00	25.00		0.9100	100.00				0.3800	100.00	0.3100	100.00	0.3000	31.1200
NCS20092	NCV20092DR2G	Active	Y	5.00	2.00	2.50		0.50	90.00	29.7700	2.14	0.13	2.40	95.25	0.08	37.6100	10.00	80.00		10.00	0.1000	100.00				1.8900	100.00	0.1700	100.00	0.1900	69.7300
NCS20092	NCV20092DTBR2G	Active	Y	5.00	2.00	2.50		0.50	90.00	10.1000		0.12	2.35	97.50	0.03	10.3800	10.00	80.00		10.00	0.3100		9.09	89.90	1.01	0.1100	100.00	0.8400	100.00	0.0700	21.8100

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.