Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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11 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame								Die Attach					Plating				Die		Wire Bond			TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Epoxy Phenol Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Magnesium (Mg) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Epoxy resin [%]	Bisphenol A_Epichlorohydrin Polymer [%]	Silver (Ag) [%]	Epoxy resins [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	7631-86-9	1333-86-4	21645-51-2	60676-86-0	n/a	7439-95-4	7440-31-5	7440-66-6	7440-47-3	7440-21-3	7440-02-0	7440-50-8	n/a	proprietary data	25068-38-6	7440-22-4	129915-35-1	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-50-8	n/a	n/a
NCP176	NCP176AMX100TCG	Last Shipments	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176AMX120TCG	Active	Y	5	2.3		5	0.4	2.3	85	0.87		0.25	0.22	0.25			99.28	0.78			85	15	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176AMX180TCG	Active	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176AMX300TCG	Last Shipments	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176AMX330TCG	Active	Y	5	2.3		5	0.4	2.3	85	0.87	0.15				0.65	3	96.2	0.78	0.5	0.5	99		0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176BMX100TCG	Active	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176BMX120TCG	Active	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176BMX180TCG	Active	Y	5	2.3		5	0.4	2.3	85	0.87		0.25	0.22	0.25			99.28	0.78	0.5	0.5	99		0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176BMX280TCG	Active	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176BMX300TCG	Last Shipments	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81
NCP176	NCP176BMX330TCG	Last Shipments	Y			10.5				89.5	0.87		0.25	0.22	0.25			99.28	0.78			75	25	0.04	5	90	5	0.01	100	0.09	1	99	0.02	1.81

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.