Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame						Die Attach			Plating		Die		Wire Bond - Au		Wire Bond - Cu		TOTAL
				Epoxy resin [%]	Metal Hydroxide [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Epoxy resins [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	29690-82-2	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	129915-35-1	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-50-8	n/a	n/a
MC34064	MC34064D-5G	Active	Y	5.00		5.00	2.00	0.50	87.50			28.5800	0.60	0.12	2.35	96.90	0.03	37.6100	75.00	25.00	2.4000	100.00	1.8900	100.00	1.3300			100.00	0.1800	71.9900
MC34064	MC34064D-5R2G	Active	Y	5.00		5.00	2.00	0.50	87.50			28.5800	0.60	0.12	2.35	96.90	0.03	37.6100	75.00	25.00	2.4000	100.00	1.8900	100.00	1.3300			100.00	0.1800	71.9900
MC34064	MC34064P-5G	Active	Y		5.00			1.00	75.00	10.00	9.00	106.1500	0.50			99.50		80.6700	75.00	25.00	5.1500	100.00	2.7400	100.00	3.2000	100.00	0.1000			198.0100

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.