Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Base part	Part	Status	Mold Compound-Black						Lead Frame					Die Attach				Die Attach Epoxy					Plating		Die		Wire Bond - Al		Wire Bond - Cu		DBC				Thermistor								TOTAL
			2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Ortho Cresol Novolac Resin [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Weight [mg]	Weight [mg]
			6386-73-8	29690-82-2	1309-64-4	1333-86-4	60676-86-0	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7440-31-5	29690-82-2	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-31-5	n/a	7440-21-3	n/a	7429-90-5	n/a	7440-50-8	n/a	1344-28-1	7440-02-0	7440-50-8	n/a	7440-22-4	7440-31-5	1313-99-1	7440-05-3	7440-02-0	1308-06-1	1317-35-7	n/a	n/a
FPAB30BH60B	FPAB30BH60B	Active, Not Rec	3	20	2.5	1	73.5	9449.18	9.9999E-4	0.099999	99.869	0.0299997	2980.02	6	92	2	34.639	3	5	85	7	1.0764	100	77.274	100	45.2664	100	50.409	100	1.79769	40	1	59	2416.55	8.00004	1.7	26	3.40001	0.699999	17.1999	43.0001	4.47358	15060.68607

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.