Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Part	Status	HF	Die		Insulating Layer						Insulating Mold							Solder Ball				Solder Mask								Substrate - Bump				Substrate - Core Material				Substrate Plating-Cu		Substrate - Plugging					TOTAL
			Silicon (Si) [%]	Weight [mg]	Epoxy resin [%]	Miscellaneous [%]	Bisphenol A_Epichlorohydrin Polymer [%]	Silica Amorphous (SiO2) [%]	Formaldehyde Polymer [%]	Weight [mg]	Hardeness [%]	1,6-Bis(2,3-epoxypropoxy)naphthalene [%]	Misc. [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Formaldehyde Polymer [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Epoxy resin [%]	3-methoxy-3-methylbutylacetate [%]	Miscellaneous [%]	Diethylene glycol monoethyl ether acetate [%]	Fused Silica (SiO2) [%]	Solvent Naphtha (Solvent oil) [%]	Barium Sulfate (BaSO4) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Other Epoxy resins [%]	Fiber Glass (SiO2) [%]	Copper (Cu) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	2-Oxiranemethanamine,N-[2-methyl-4-(2-oxiranylmethoxy)phenyl]-N-(2-oxiranylmethyl) [%]	Miscellaneous [%]	Bisphenol A_Epichlorohydrin Polymer [%]	Formaldehyde Polymer [%]	Weight [mg]	Weight [mg]
			7440-21-3	n/a	proprietary data	trade secret	25068-38-6	7631-86-9	9003-36-5	n/a	proprietary data	27610-48-6	proprietary data	1333-86-4	60676-86-0	9003-36-5	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	proprietary data	103429-90-9	trade secret	112-15-2	60676-86-0	64742-94-5	7727-43-7	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	proprietary data	65997-17-3	7440-50-8	n/a	7440-50-8	n/a	110656-67-2	trade secret	25068-38-6	9003-36-5	n/a	n/a
QT62012	Last Shipments	Y	100	138.921	3.2	41.7	8.7	37.7	8.7	26.01	8.1	2.69	2.69	0.5	69.89	16.13	11	3	96.5	0.5	135.578	38	13	4	13	10	8	14	20.086	3	96.5	0.5	5.483	30	30	40	237.037	100	141.406	15	45	30	10	8.355	723.876

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.