Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Die		Wire Bond - Au		Capacitor									Laminate Board																												Solder Paste							TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Metal Hydroxide [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Silicon Dioxide [%]	Titanium Dioxide (TiO2) [%]	Boron Trioxide (B2O3) [%]	Tin (Sn) [%]	Misc. [%]	Barium Monoxide (BaO) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	triethylenediamine [%]	Sodium citrate [%]	Tetraammine palladium (II) dichloride [%]	D.I. Water [%]	Nickel Sulfamate [%]	copper [%]	copper foil [%]	continuous filament fiber glass [%]	Defoamers [%]	Phthalocyanine blue [%]	Organic Filler [%]	Acrylate resin [%]	Diproplyeneglycolmonomethylether [%]	Gold Potassium Cyanide [%]	Thermosetting resin [%]	Silica [%]	Talc [%]	3-methoxy-3-methylbutylacetate [%]	Naphthalene [%]	Fiber Glass (SiO2) [%]	Photoinitiator [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Solvent Naphtha (Solvent oil) [%]	Copper (Cu) [%]	Barium Sulfate (BaSO4) [%]	Weight [mg]	2-(2-Hexyloxyethoxy) ethanol [%]	Denatured Acid Hydrogenation Rosin [%]	Dimer Acid [%]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	7440-21-3	n/a	7440-57-5	n/a	7631-86-9	13463-67-7	1303-86-2	7440-31-5	proprietary data	1304-28-5	7440-02-0	7440-50-8	n/a	280-57-9	68-04-2	13815-17-3	7732-18-5	13770-89-3	7440-66-6	n/a	n/a	n/a	n/a	n/a	n/a	34590-97-8	13967-50-5	proprietary data	proprietary data	14807-96-6	103429-90-9	91-20-3	65997-17-3	proprietary data	7440-05-3	7440-02-0	7440-57-5	64742-94-5	7440-50-8	7727-43-7	n/a	112-59-4	proprietary	proprietary	7440-22-4	7440-31-5	7440-50-8	n/a	n/a
EZAIRO 7111	E7111-0-102A19-AG	Active	Y	8	5	1	25	1	60	16.5	100	10.50806	100	0.6612	1.82962963	20.2222222	0.457407407	5.648148148	6.740740741	40.4444444	4.074074074	20.583333333	3.39	0.003485433	0.001742716	0.004040327	0.400902777	0.667208899	34.62963659	3.760421211	11.7379918	0.518265182	0.07407899	0.088879073	5.213323851	1.110827195	0.044504292	25.24358	0.103670485	0.311124711	2.295532876	0.103670485	1.97341542	0.533065265	2.0917E-4	3.13755E-4	1.04585E-4	0.533065265	6.722001508	3.925252766	15.05	4	4	2	3	86	1	3.12	49.22926
EZAIRO 7111	E7111-0-102A19-BPG	Active	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.