Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1  Non-hybrid  devices found

Non-hybrid devices

Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Die   Wire Bond - Al   Case   Case Lid   DBC   Glue   Heat Sink   NTC   Silicone Gel   Solder Paste   Terminal   TOTAL 
Silicon (Si)
[%]
Weight
[mg]
Aluminum (Al)
[%]
Weight
[mg]
Fiber Glass (SiO2)
[%]
PBT
[%]
Weight
[mg]
Fiber Glass (SiO2)
[%]
PBT
[%]
Weight
[mg]
Aluminum Trioxide (Al2O3)
[%]
Nickel (Ni)
[%]
Copper (Cu)
[%]
Weight
[mg]
2,3-epoxypropyl-trimethoxysilan
[%]
Miscellaneous
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Nickel (Ni)
[%]
Copper (Cu)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Nickel Oxide (NiO)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Cobalt Oxide (Co3O4)
[%]
Manganese Tetraoxide (Mn3O4)
[%]
Weight
[mg]
Silica, [(ethenyldimethylsilyl)oxy]- and [(trimethylsilyl)oxy]- modified
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Silicon (Si)
[%]
Nickel (Ni)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Weight
[mg]
7440-21-3 n/a 7429-90-5 n/a 65997-17-3 26062-94-2 n/a 65997-17-3 26062-94-2 n/a 1344-28-1 7440-02-0 7440-50-8 n/a 2530-83-8 trade secret 14808-60-7 n/a 7440-02-0 7440-50-8 n/a 7440-22-4 7440-31-5 1313-99-1 7440-05-3 7440-02-0 1308-06-1 1317-35-7 n/a 68988-89-6 14808-60-7 n/a 7440-22-4 7440-31-5 7440-50-8 n/a 7440-21-3 7440-02-0 7440-50-8 7723-14-0 n/a n/a
NXH200T120H3Q2F2STNG NXH200T120H3Q2F2STNG Active  Y   Download xls Download xml Download xml Download xml  100.00   219.1050   100.00   39.0000   35.00   65.00   10,330.0000   35.00   65.00   6,690.0000   41.70   0.20   58.10   17,490.0000   10.00   10.00   80.00   410.0000   1.55   98.45   123,450.0000   0.98   0.20   39.17   1.00   0.10   4.00   54.56   10.0000   30.00   70.00   8,400.0000   6.50   96.50   0.50   5,040.0000   0.27   1.35   98.36   0.03   3,540.0000   175,618.1050 

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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