Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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106 Non-hybrid devices found
Non-hybrid devices
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Mold Compound-Black
Lead Frame
Die Attach
Plating
Die
Wire Bond - Au
TOTAL
Phenolic Resin [%]
Ortho Cresol Novolac Resin [%]
Epoxy Phenol Resin [%]
Carbon Black (C) [%]
Fused Silica (SiO2) [%]
Weight [mg]
Silver (Ag) [%]
Zinc (Zn) [%]
Iron (Fe) [%]
Copper (Cu) [%]
Phosphorus (P) [%]
Weight [mg]
Silver (Ag) [%]
Phenolic Resin-2 [%]
Weight [mg]
Tin (Sn) [%]
Weight [mg]
Silicon (Si) [%]
Weight [mg]
Gold (Au) [%]
Weight [mg]
Weight [mg]
proprietary data
29690-82-2
proprietary data
1333-86-4
60676-86-0
n/a
7440-22-4
7440-66-6
7439-89-6
7440-50-8
7723-14-0
n/a
7440-22-4
54208-63-8
n/a
7440-31-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP300
NCP300HSN09T1
Obsolete
No data available
NCP300
NCP300HSN09T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300
NCP300HSN10T1
Obsolete
No data available
NCP300
NCP300HSN11T1
Obsolete
No data available
NCP300
NCP300HSN12T1
Obsolete
No data available
NCP300
NCP300HSN13T1
Obsolete
No data available
NCP300
NCP300HSN14T1
Obsolete
No data available
NCP300
NCP300HSN15T1
Obsolete
No data available
NCP300
NCP300HSN16T1
Obsolete
No data available
NCP300
NCP300HSN17T1
Obsolete
No data available
NCP300
NCP300HSN18T1
Obsolete
No data available
NCP300
NCP300HSN18T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300
NCP300HSN19T1
Obsolete
No data available
NCP300
NCP300HSN20T1
Obsolete
No data available
NCP300HSN21T1
Obsolete
No data available
NCP300HSN22T1
Obsolete
No data available
NCP300HSN23T1
Obsolete
No data available
NCP300HSN24T1
Obsolete
No data available
NCP300HSN25T1
Obsolete
No data available
NCP300HSN26T1
Obsolete
No data available
NCP300
NCP300HSN27T1
Obsolete
No data available
NCP300
NCP300HSN27T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300HSN28T1
Obsolete
No data available
NCP300HSN29T1
Obsolete
No data available
NCP300
NCP300HSN30T1
Obsolete
No data available
NCP300
NCP300HSN30T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300HSN31T1
Obsolete
No data available
NCP300HSN32T1
Obsolete
No data available
NCP300HSN33T1
Obsolete
No data available
NCP300HSN34T1
Obsolete
No data available
NCP300HSN35T1
Obsolete
No data available
NCP300HSN36T1
Obsolete
No data available
NCP300HSN37T1
Obsolete
No data available
NCP300HSN38T1
Obsolete
No data available
NCP300HSN39T1
Obsolete
No data available
NCP300HSN40T1
Obsolete
No data available
NCP300HSN41T1
Obsolete
No data available
NCP300HSN42T1
Obsolete
No data available
NCP300HSN43T1
Obsolete
No data available
NCP300HSN44T1
Obsolete
No data available
NCP300
NCP300HSN45T1
Obsolete
No data available
NCP300
NCP300HSN45T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300HSN46T1
Obsolete
No data available
NCP300
NCP300HSN47T1
Obsolete
No data available
NCP300
NCP300HSN47T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300HSN48T1
Obsolete
No data available
NCP300HSN49T1
Obsolete
No data available
NCP300
NCP300LSN09T1
Obsolete
No data available
NCP300
NCP300LSN09T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
7.3400
1.22
0.12
2.35
96.28
0.03
5.7800
80.00
20.00
0.1100
100.00
0.3900
100.00
0.4200
100.00
0.0400
14.0800
NCP300
NCP300LSN10T1
Obsolete
No data available
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .