Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame						Die Attach												Plating						Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Ethylene dimethacrylate [%]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Phenolic Resin [%]	Inorganic filler [%]	Dicyandiamine [%]	Aluminum Trioxide (Al2O3) [%]	Formaldehyde Polymer [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	14464-46-1	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	97-90-5	129915-35-1	7440-22-4	129915-35-1	54208-63-8	proprietary data	proprietary data	461-58-5	1344-28-1	9003-36-5	n/a	7440-22-4	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
LMV358_XFCS	LMV358AM8X	Last Shipments	Y			6.25		0.20		87.04	6.51	45.2900		0.13	2.35	97.44	0.08	31.1360				74.00		26.00						1.1440	1.61		3.45	92.87	2.07	0.4350	100.00	2.1600	100.00	0.6270	80.7920
LMV358_XFCS	LMV358AMU8X	Last Shipments	Y			5.00		1.00	89.00		5.00	15.9000		0.12	2.30	97.55	0.03	23.7600				80.00		20.00						0.2590			9.06	89.64	1.29	0.3090	100.00	2.2200	100.00	0.3360	42.7840
LMV358	LMV358DMR2G	Active	Y	5.00	5.00	2.00		0.50	87.50			14.9600	2.50	0.10	2.40	95.00		14.2600	2.50			84.50			2.50	2.50	0.50		7.50	0.9100		100.00				0.3800	100.00	0.3100	100.00	0.3000	31.1200
LMV358	LMV358DR2G	Active	Y	5.00	5.00	2.00		0.50	87.50			28.5800	2.10	0.20	2.50	95.20		37.6100				75.00	25.00							2.4000		100.00				1.8900	100.00	1.3300	100.00	0.1900	72.0000
LMV358	LMV358IDR2G	Active	Y	5.00	2.00	2.50		0.50	90.00			29.7700	2.14	0.13	2.40	95.25	0.08	37.6100	10.00	5.00		80.00							5.00	0.1000		100.00				1.8900	100.00	0.1700	100.00	0.1900	69.7300
LMV358	LMV358MUTAG	Active	Y				9.00		91.00			2.1500		0.10	2.20	97.70		0.7300			32.00							68.00		0.1200			3.20	95.70	1.10	0.0100	100.00	0.1700	100.00	0.0700	3.2500

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices