Material Composition

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Cu   TOTAL 
Ortho Cresol Novolac Resin
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Ortho-Cresol Novolac Resin
[%]
Phenolic Resin (Novolac)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Bis(a,a-dimethylbenzyl) Peroxide
[%]
Isobornyl Methacrylate
[%]
Silver (Ag)
[%]
Isobornyl Acrylate
[%]
Tricyclo[5.2.1.02,6]decanedimethanol Diacrylate (C18H24O4)
[%]
Acrylic resins
[%]
Weight
[mg]
Silver (Ag)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
29690-82-2 1333-86-4 60676-86-0 29690-82-2 9003-35-4 14808-60-7 n/a 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a 80-43-3 7534-94-3 7440-22-4 5888-33-5 42594-17-2 proprietary data n/a 7440-22-4 7440-05-3 7440-02-0 7440-57-5 n/a 7440-21-3 n/a 7440-50-8 n/a n/a
FDMA8878 FDMA8878 Active  Y   Download xls Download xml Download xml Download xml     0.5   88   6.5   5      4.878   0.141509   2.40566   97.4057   0.0471698   4.24         85         15   0.108      8.16327   89.7959   2.04082   0.049   100   0.569   100   0.035   9.879 
FDMA8878 FDMA8878-F130 Active  Y   Download xls Download xml Download xml Download xml  5.4987   0.19948   75.3014      14.0004   5   4.612   0.124724   2.35015   97.4432   0.0819614   4.0051   0.515464   5.54124   82.8608   5.54124   5.54124      0.0776   1.53   3.57   92.86   2.04   0.056   100   0.6023   100   0.087   9.44 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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