Material Composition

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4  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Die Attach   Die   Wire Bond - Au   Imaging Lens   Lid Attach   Solder Ball   Substrate and Solder Mask   TOTAL 
Phenolic Resin
[%]
Oxirane
[%]
1,4-Bis(2,3-epoxypropoxy)butane
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
Bisphenol A_Epichlorohydrin Polymer
[%]
Ethylene Glycol
[%]
Sulfonium (Thiodi-4,1-phenylene)
[%]
Modified Silicon Dioxide (SiO2)
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Misc.
[%]
Silicon (Si)
[%]
Aluminum (Al)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Titanium Dioxide (TiO2)
[%]
Sodium Monoxide (Na2O)
[%]
Boron Trioxide (B2O3)
[%]
Zinc Monoxide (ZnO)
[%]
Aluminum Trioxide (Al2O3)
[%]
Potassium Monoxide (K2O)
[%]
Silica Crystalline (SiO2)
[%]
Weight
[mg]
2,2-Bis(glycidyloxyphenyl)propane polymer
[%]
3,4-EPOXYCYCLOHEXYLMETHYL
[%]
Bisphenol A_Epichlorohydrin Polymer
[%]
Filler (SiO2)
[%]
Misc.
[%]
Epoxy Prepolymer
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Nickel (Ni)
[%]
Gold (Au)
[%]
Cured Resin of Solder Mask
[%]
Bismaleimide Triazine resin
[%]
Copper (Cu)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 39817-09-9 2425-79-8 1333-86-4 60676-86-0 14808-60-7 n/a 25068-38-6 107-21-1 89452-37-9 67762-90-7 9003-36-5 n/a proprietary data 7440-21-3 7429-90-5 n/a 7440-57-5 n/a 13463-67-7 1313-59-3 1303-86-2 1314-13-2 1344-28-1 12136-45-7 14808-60-7 n/a 25085-99-8 2386-87-0 25068-38-6 68909-20-6 proprietary data proprietary data 9003-36-5 n/a 7440-22-4 7440-31-5 7440-50-8 n/a 7440-02-0 7440-57-5 proprietary data proprietary data 7440-50-8 n/a n/a
AR0230CS AR0230CSSC00SUEA0-DRBR Active  Y   Download xls Download xml Download xml Download xml  15.00   15.00   3.00   1.00   64.00   2.00   41.3600   37.50   1.00   3.00   21.00   37.50   1.6600   0.38   98.63   0.99   35.4500   100.00   0.6800   5.26   5.26   0.53   5.26   5.26   5.26   73.16   60.6000   25.00   72.50         2.50         1.4100   3.00   96.50   0.50   38.8600   4.00   0.40   24.00   60.00   11.60   77.4900   257.5100 
AR0230CS AR0230CSSC00SUEA0-DRBR1 Obsolete  Y           No data available
AR0230CS AR0230CSSC12SUEA0-DR Active  Y   Download xls Download xml Download xml Download xml  15.00   15.00   3.00   1.00   64.00   2.00   41.3600   37.50   1.00   3.00   21.00   37.50   1.6600   0.38   98.63   0.99   35.4500   100.00   0.6800   5.26   5.26   0.53   5.26   5.26   5.26   73.16   60.6000         31.60   5.20      31.60   31.60   1.4100   3.00   96.50   0.50   38.8600   4.00   0.40   24.00   60.00   11.60   77.4900   257.5100 
AR0230CS AR0230CSSC12SUEA0-DR1 Obsolete  Y           No data available
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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