Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Die Attach						Die				Wire Bond - Au		Imaging Lens								Lid Attach								Solder Ball				Substrate and Solder Mask						TOTAL
				Phenolic Resin [%]	Oxirane [%]	1,4-Bis(2,3-epoxypropoxy)butane [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Bisphenol A_Epichlorohydrin Polymer [%]	Ethylene Glycol [%]	Sulfonium (Thiodi-4,1-phenylene) [%]	Modified Silicon Dioxide (SiO2) [%]	Formaldehyde Polymer [%]	Weight [mg]	Misc. [%]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Titanium Dioxide (TiO2) [%]	Sodium Monoxide (Na2O) [%]	Boron Trioxide (B2O3) [%]	Zinc Monoxide (ZnO) [%]	Aluminum Trioxide (Al2O3) [%]	Potassium Monoxide (K2O) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	2,2-Bis(glycidyloxyphenyl)propane polymer [%]	3,4-EPOXYCYCLOHEXYLMETHYL [%]	Bisphenol A_Epichlorohydrin Polymer [%]	Filler (SiO2) [%]	Misc. [%]	Epoxy Prepolymer [%]	Formaldehyde Polymer [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Nickel (Ni) [%]	Gold (Au) [%]	Cured Resin of Solder Mask [%]	Bismaleimide Triazine resin [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	39817-09-9	2425-79-8	1333-86-4	60676-86-0	14808-60-7	n/a	25068-38-6	107-21-1	89452-37-9	67762-90-7	9003-36-5	n/a	proprietary data	7440-21-3	7429-90-5	n/a	7440-57-5	n/a	13463-67-7	1313-59-3	1303-86-2	1314-13-2	1344-28-1	12136-45-7	14808-60-7	n/a	25085-99-8	2386-87-0	25068-38-6	68909-20-6	proprietary data	proprietary data	9003-36-5	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-02-0	7440-57-5	proprietary data	proprietary data	7440-50-8	n/a	n/a
AR0230CS	AR0230CSSC00SUEA0-DRBR	Active	Y	15	15	3	1	64	2	41.36	37.5	1	3	21	37.5	1.66	0.38	98.63	0.99	35.45	100	0.68	5.263	5.263	0.527	5.263	5.263	5.263	73.158	60.6	25	72.5			2.5			1.41	3	96.5	0.5	38.86	4	0.4	24	60	11.6	77.49	257.51
AR0230CS	AR0230CSSC00SUEA0-DRBR1	Obsolete	Y	No data available
AR0230CS	AR0230CSSC12SUEA0-DR	Active	Y	15	15	3	1	64	2	41.36	37.5	1	3	21	37.5	1.66	0.38	98.63	0.99	35.45	100	0.68	5.263	5.263	0.527	5.263	5.263	5.263	73.158	60.6			31.6	5.2		31.6	31.6	1.41	3	96.5	0.5	38.86	4	0.4	24	60	11.6	77.49	257.51
AR0230CS	AR0230CSSC12SUEA0-DR1	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.