ON Semiconductor is committed to providing our customers with products that are compliant with environmental regulations. It is our primary objective to enable our customers with a smooth transition as our products are converted to Pb-free lead finishes.
RoHS Policy Statement
ON Semiconductor has converted the majority of its products for the customers who must meet the requirements of the European Union Directie on the Restrictions on use of certain Hazardous Substances (RoHS). We are also well prepared to meet the requirements of upcoming China's Management Measures on Electronic information Product Pollution Control (China-RoHS) regulation.
Industry information on China-RoHS
We will support customers with Pb product providing business remains profitable & sensible.
REACH Statement
ON Semiconductor supports the aim of REACH in improving the protection of human health and the environment through the better and earlier identification of the intrinsic properties of chemical substances. ON Semiconductor will meet all REACH requirements and is committed to provide our customers with information about substances in our products according to future REACH requirements.
REACH Statement
Social Responsibility Statement
ON Semiconductor is committed to providing our customers with quality
products that are environmentally sound.
Social Responsibility Statement
Green Partner Certificates
ON Semiconductor has received certifications from its customers for achieving their strict environmental requirements, product stewardship and for implementation of an environmental management system. View certificates of achievement.
Pb-free Plating Selection
ON Semiconductor initially considered the following candidates for Pb-free plating: SnAg, SnBi, SnCu, NiPdAu, and matte tin. The properties of each of these lead finishes can be summarized as follows:
| SnAg |
- good solderability and mechanical properties
- high material cost
- need for extensive plating bath control procedures
|
| SnBi |
- widespread use in Japan
- tends to be brittle
- complex plating control
- concern over backward compatibility with Pb-containing solders
|
| SnCu |
- relatively inexpensive
- good solderability
- small changes in alloy composition could cause large changes in eutectic temperature
- difficult to accurately control plating composition
- lead finish not compatible with Alloy 42 leadframes
|
| NiPdAu |
- simplified assembly process
- unpredictable high cost
- limited number of vendors
- concerns with cracking of the plating at bends, soldering, wire bonding, molding
- not compatible with Alloy 42 leadframes
|
| Matte tin |
- extensive industry experience with implementation
- well established history of reliability
- good soldering characteristics over a wide range of leadframes
- relatively low cost
- no binary alloy composition issues to manage
- no issues with availability
- compatible with Pb-free and Pb-containing solders
- melting point of 232°C fits well with the 230°C to 260°C heat reflow profile of today's components
|
For the reasons listed above and since ON Semiconductor had a long history of using matte Sn for specific applications, a matte Sn process solution was the preferred choice for the vast majority of products requiring a Pb-free external finish.
Pb-free Product Offering
ON Semiconductor now offers a portfolio of products that are plated with Pb-free lead finishes. We are committed to meeting the needs of our customers in a timely manner as our industry transitions to become RoHS compliant. Please contact your local sales representative and inform them of your conversion plans so that we may include them in our capacity planning for Pb-free devices.
Note: Many of our products were originally released as Pb-free and do not have a comparable leaded version available. For devices which have been Pb-free since their inception, we do not intend to introduce any new Pb-containing lead finish versions of those devices.
