Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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14 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame					Die Attach			Plating				Die			Wire Bond - Au		Bump			Protection coat		Solder Ball			Under Bump Metal			TOTAL
				Epoxy and Phenolic Resin [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Copper (Cu) [%]	Weight [mg]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Polyimide [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				40216-08-8	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	7440-31-5	7440-66-6	7440-47-3	7440-50-8	n/a	129915-35-1	1344-28-1	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	7429-90-5	n/a	7440-57-5	n/a	7440-31-5	7440-50-8	n/a	proprietary data	n/a	7440-22-4	7440-31-5	n/a	7440-32-6	7440-50-8	n/a	n/a
NCP167	NCP167AFCT180T2G	Active	Y																			99.4318	0.568182	0.24779			24.7	75.3	0.0438	100	0.00637				1.77	98.23	0.015771	0.313731
NCP167	NCP167AFCT285T2G	Active	Y																			99.4318	0.568182	0.24779			24.7	75.3	0.0438	100	0.00637				1.77	98.23	0.015771	0.313731
NCP167	NCP167AFCT295T2G	Active	Y																			99.4318	0.568182	0.24779			24.7	75.3	0.0438	100	0.00637				1.77	98.23	0.015771	0.313731
NCP167	NCP167AFCT330T2G	Active	Y																			99.4318	0.568182	0.24779						100	0.00637	2.6	97.4	0.0438	1.77	98.23	0.015771	0.313731
NCP167	NCP167AFCT350T2G	Active	Y																			99.4318	0.568182	0.24779			24.7	75.3	0.0438	100	0.00637				1.77	98.23	0.015771	0.313731
NCP167	NCP167AFCTC350T2G	Active	Y																			99.4318	0.568182	0.24779			24.7	75.3	0.0438	100	0.00637				1.77	98.23	0.015771	0.313731
NCP167	NCP167AMX180TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434
NCP167	NCP167AMX280TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434
NCP167	NCP167AMX285TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434
NCP167	NCP167AMX300TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434
NCP167	NCP167AMX330TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434
NCP167	NCP167AMX350TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434
NCP167	NCP167BFCT330T2G	Active	Y																			99.4318	0.568182	0.24779			24.7	75.3	0.0438	100	0.00637				1.77	98.23	0.015771	0.313731
NCP167	NCP167BMX330TBG	Active	Y	8	0.5	2	86.5	3	0.6	0.25	0.22	0.25	99.28	0.58	32	68	0.13	2.4	88	9.6	0.004	100		0.09	100	0.03												1.434

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.