Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame								Die Attach			Die Attach Tape						Plating					Die		Wire Bond				Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Magnesium (Mg) [%]	Zinc (Zn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Ortho-Cresol Novolac Resin [%]	Weight [mg]	Oxirane, (chloromethyl)-, homopolymer [%]	2-Propenoic acid, 2-methyl-, polymer with butyl 2-propenoate and methyl 2-methyl-2-propenoate [%]	Proprietary [%]	Silica Amorphous (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	7631-86-9	1333-86-4	21645-51-2	60676-86-0	n/a	7439-95-4	7440-66-6	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	29690-82-2	n/a	24969-06-0	25035-69-2	proprietary data	7631-86-9	9003-35-4	n/a	7440-22-4	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-57-5	7440-50-8	n/a	7440-57-5	n/a	n/a
NC7SV126	NC7SV126L6X	Last Shipments	Y	5	2.3		5	0.4	2.3	85	1.204	0.13		0.78	3.25		95.84		0.802872				15	15	10	45	15	0.003	0.27	0.66	98.74	0.33	0.024942	100	0.04	2	0.13	97.87	0.012			2.086814
NC7SV126	NC7SV126P5X	Last Shipments	Y	5	2	2.5		0.5		90	2.4264		0.127443			2.36983	97.4208	0.0819274	3.2956	80	20	0.0202								4.09836	95.082	0.819672	0.0244	100	0.2027					100	0.0304	5.9997

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.