Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame					Die Attach							Plating				Die		Wire Bond - Au		Substrate							TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Silica (SiO2) [%]	Weight [mg]	Magnesium (Mg) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Ethylene glycol dicyclopentenyl ether methacrylate [%]	Bis(a,a-dimethylbenzyl) Peroxide [%]	Silver (Ag) [%]	Bis-phenol A Diglycidyl Ether [%]	Ortho Cresol Novolac Resin [%]	2,4,6-Tris[Bis(Methoxymethyl)Amino]-1,3,5-Triazine [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Bismaleimide [%]	Cyanic acid (1-methylethylidene)di-4,1-phenylene ester homopolymer [%]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	14464-46-1	n/a	7439-95-4	7440-21-3	7440-02-0	7440-50-8	n/a	68586-19-6	80-43-3	7440-22-4	1675-54-3	29690-82-2	3089-11-0	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	13676-54-5	25722-66-1	1344-28-1	7440-02-0	7440-57-5	7440-50-8	n/a	n/a
FSUSB11	FSUSB11L10X	Last Shipments	Y			15	0.5		84.5	4.45									20	60	20	0.016		82	18	0.02495	100	2.1186	100	0.079992	49.25	32	2.54	1	0.21	15	2.12415	8.813692
FSUSB11	FSUSB11MTCX	Last Shipments	Y	9.5	5		0.5	85		32.2	0.148402	0.64926	3.20456	95.9978	21.563	3.5	0.65	95.85				0.055	3.10559	95.0311	1.86335	0.161	100	0.496	100	0.348								54.823

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.