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Package Drawings for  Non-Isolated Conversion (Show All)

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Document Title
Document ID/Size
Revision
5 LEAD D2PAK 936A-02 (63kB) E
5X6MM, .5MM PITCH 505 (41kB) D
8 LEAD PDIP 626-05 (51kB) P
8 PIN DFN, 4x4 488AF (44kB) C
CPH3 318BA (33kB) O
ChipFET 1206A-03 (53kB) K
DFN 3x3x0.9mm, 0.95p 506AH (46kB) O
DPAK 5 Center Lead Crop 175AA (47kB) B
Micro8 Surface Mount 846A-02 (56kB) K
SC 88FL / MCPH6 419AS (38kB) O
SC-70 (SOT-323) 3 LEAD 419-04 (47kB) N
SC-89, 3 LEAD 463C-02 (43kB) C
SOD-323 2 LEAD 477-02 (44kB) H
SOD-523 2 LEAD 502-01 (43kB) E
SOIC 16 LEAD 751B-05 (50kB) K
SOIC 16 LEAD WIDE BODY, EXPOSED PAD 751R-02 (55kB) B
SOIC-16 Wide Body, Exposed Pad 751AG (56kB) B
SOIC-8 Narrow Body 751-07 (53kB) AK
SOT-28FL / ECH8 318BF (37kB) O
TO-220 5 LEAD 314D-04 (45kB) H
TO-220 5 LEAD OFFSET 314B-05 (45kB) L
TSOP-6 318G-02 (51kB) V
WDFN3 2x2x0.75 mm, 1.3 mm Pitch 506AU (41kB) A
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