C-SERIES SIPM ARRAY: Silicon Photomultiplier Arrays, C-Series (SiPM)

Datasheet: Silicon Photomultiplier (SiPM) 4-Side Scaleable Arrays
Rev. 8 (1545kB)
Product Overview
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Product Change Notification

4-Side Scalable Arrays of C-Series SiPM Sensors:

ON Semiconductor's C-Series silicon photomultiplier (SiPM) sensors are used to create compact and scalable arrays. The MLP-packaged sensors are mounted onto PCB boards with minimal dead space and are available in a variety of formats, formed of sensors of either 1 mm, 3 mm or 6 mm. The back of each ArrayC has either multi-way connectors or a ball grid array (BGA), to give access to the fast* and standard outputs, and a common I/O from the summed substrates of the pixels.

* Note that the ARRAYC-60035-4P-BGA does not have fast outputs.

Features
 
  • 4-Side scalable arrays
  • Variety of formats ranging from 2×2 to 12×12
  • Minimal deadspace at the edges allowing tiling on all sides to allow the creation to still larger detection areas
  • Each array has either a multi-way connector or BGA on the reverse for access to all signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual C-Series sensors
  • Optional evaluation boards for are available for easy access to signals
Applications
  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics
Technical Documentation & Design Resources
Application Notes (7) Package Drawings (4)
Data Sheets (1)  
Evaluation/Development Tool Information
Product Status Compliance Short Description Action
ARRAYC-60035-4P-GEVB Active
C-Array 6mm 35u 2x2 EVB
ARRAYX-BOB3-144P-GEVK Active
C-Array 3mm 12x12 BOB
ARRAYX-BOB3-16P-GEVK Active
C-Array 3mm 4x4 BOB
ARRAYX-BOB3-16S-GEVK Active
C-Array 3mm 4x4 Sum BOB
ARRAYX-BOB6-64P-GEVK Active
C/J-Array 6mm 8x8 BOB
Availability & Samples
Specifications
Product
Status
Compliance
Description
Package
MSL
Container
Budgetary Price/Unit
Type
Case Outline
Type
Temperature
Type
Qty.
ARRAYC-30035-144P-PCB Active
Pb-free
Halide free
C-SERIES SIPM ARRAY, 12 x 12 Array of MicroFC-30035-SMT pixels on PCB ARRAYC-300XX-144P-PCB 100DE 1 260 UNTBX 1 Contact Sales Office
ARRAYC-30035-16P-PCB Active
Pb-free
Halide free
C-SERIES SIPM ARRAY, 4 x 4 Array of MicroFC-30035-SMT pixels on PCB ARRAYC-300XX-16P-PCB 100DF 1 260 UNTBX 1 Contact Sales Office
ARRAYC-60035-4P-BGA Active
Pb-free
Halide free
C-SERIES SIPM ARRAY, 2 x 2 Array of MicroFC-60035-SMT pixels on PCB ARRAYC-600XX-4P-BGA 100DG 1 260 UNTBX 1 Contact Sales Office
ARRAYC-60035-64P-PCB Active
Pb-free
Halide free
C-SERIES SIPM ARRAY, 8 x 8 Array of MicroFC-60035-SMT pixels on PCB ARRAYC-600XX-64P-PCB 100DH 1 260 UNTBX 1 Contact Sales Office
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : Contact Factory
Market Leadtime (weeks) : Contact Factory

Product
Description
Pricing ($/Unit)
Compliance
Status
Type
Array Format
Active Area Dimensions
Microcell Size (µm)
Optimized Wavelength (nm)
PDE @ Max Overvoltage (%)
DCR @ Typical Overvoltage (KHz/mm2)
Package Type
ARRAYC-30035-144P-PCB  
Pb
H
 Active   
Array
12 x 12
3 mm x 3 mm
35
420
41
30
ARRAYC-300XX-144P-PCB
ARRAYC-30035-16P-PCB  
Pb
H
 Active   
Array
4 x 4
3 mm x 3 mm
35
420
41
30
ARRAYC-300XX-16P-PCB
ARRAYC-60035-4P-BGA  
Pb
H
 Active   
Array
2 x 2
6 mm x 6 mm
35
420
41
30
ARRAYC-600XX-4P-BGA
ARRAYC-60035-64P-PCB  
Pb
H
 Active   
Array
8 x 8
6 mm x 6 mm
35
420
41
30
ARRAYC-600XX-64P-PCB
Case Outlines
100DE    100DF    100DG    100DH   
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