Silicon Photomultipliers (SiPM) | ARRAYJ

Silicon Photomultiplier Arrays, J-Series (SiPM)

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Overview

High Fill-Factor Arrays of J-Series SiPM Sensors:

ON Semiconductor's J-Series silicon photomultiplier (SiPM) sensors have been used to create high fill-factor, scalable arrays. The TSV-packaged sensors are mounted onto PCB boards with minimal dead space. The ArrayJ products are available in a variety of formats and formed of either 3 mm, 4 mm or 6 mm pixels. The back of each ArrayJ has either one or more multi-way connectors or a BGA (ball grid array) that allow access to each pixels standard output, and in some cases, the fast output as well.

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics

  • High fill-factor, scalable arrays
  • Variety of formats ranging from 2×2 to 8×8
  • Minimal deadspace, with fill factors of >90%
  • Each array as either a multi-way connector or BGA on the reverse for access to all signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual J-Series sensors
  • Optional evaluation boards are available for easy access to signals

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Array Format

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PDE @ Max Overvoltage (%)

DCR @ Typical Overvoltage (KHz/mm2)

Reference Price

ARRAYJ-30020-16P-PCB

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CAD Model

Pb

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ARRAYJ-300XX-16P-PCB

100DJ

1

260

UNTBX

1

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Array

4 x 4

3 mm x 3 mm

20

420

38

50

Price N/A

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ARRAYJ-30020-64P-PCB

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CAD Model

Pb

A

H

P

ARRAYJ-300XX-64P-PCB

100DK

1

260

UNTBX

1

Y

Array

8 x 8

3 mm x 3 mm

20

420

38

50

Price N/A

More Details

ARRAYJ-30035-16P-PCB

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CAD Model

Pb

A

H

P

ARRAYJ-300XX-16P-PCB

100DJ

1

260

UNTBX

1

Y

Array

4 x 4

3 mm x 3 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-30035-64P-PCB

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CAD Model

Pb

A

H

P

ARRAYJ-300XX-64P-PCB

100DK

1

260

UNTBX

1

Y

Array

8 x 8

3 mm x 3 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-40035-64P-PCB

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CAD Model

Pb

A

H

P

ARRAYJ-400XX-64P-PCB

100DS

1

260

UNTBX

1

Y

Array

8 x 8

4 mm x 4 mm

35

420

50

50

Price N/A

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ARRAYJ-60035-4P-BGA

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CAD Model

Pb

A

H

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ARRAYJ-600XX-4P

100DL

1

260

UNTBX

1

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Array

2 x 2

6 mm x 6 mm

35

420

50

50

Price N/A

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ARRAYJ-60035-4P-PCB

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CAD Model

Pb

A

H

P

ARRAYJ-600XX-4P-PCB

100DP

1

260

UNTBX

1

Y

Array

2 x 2

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-60035-64P-PCB

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Active

CAD Model

Pb

A

H

P

ARRAYJ-600XX-64P-PCB

100DM

1

260

UNTBX

1

Y

Array

8 x 8

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

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Reliability Data

Die Related Summary Data

Device: ARRAYJ-30020-16P-PCB

Equivalent to wafer fab process: CMOS SUB

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

CMOS SUB

2

920154574

More Details

Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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