Integrated Driver & MOSFET | NCP303150

Integrated Driver and MOSFET with IntegratedCurrent Monitor

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Overview

The NCP303150 integrates a MOSFET driver, high−side MOSFETand low−side MOSFET into a single package.The driver and MOSFETs have been optimized for high−currentDC−DC buck power conversion applications. The NCP303150integrated solution greatly reduces package parasitics and board spacecompared to a discrete component solution.

  • Desktop & Notebook Microprocessors
  • Graphic Cards
  • Routers and Switches
  • Supports Intel® Power State 4

  • High−Performance, Universal Footprint, Copper−Clip 5 mm x 6 mmPQFN Package
  • 30 V / 30 V Breakdown Voltage MOSFETs for Higher Long TermReliability
  • Capable of Average Currents up to 50 A
  • Capable of Switching at Frequencies up to 1 MHz
  • Compatible with 3.3 V or 5 V PWM Input
  • Responds Properly to 3−level PWM Inputs
  • Precise Current Monitoring
  • Option for Zero Cross Detection with 3−level PWM
  • Internal Bootstrap Diode
  • Supports Intel® Power State 4
  • Catastrophic Fault Detection♦ Thermal Flag (OTP) for Over−Temperature Condition♦ Over−Current Protection FAULT (OCP)♦ Under−Voltage Lockout (UVLO) on VCC and PVCC

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Reliability Data

Die Related Summary Data

Device: NCP303150MNTWG

Equivalent to wafer fab process: DrMOS BCD + PT MCM

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

DrMOS BCD + PT MCM

1

412052959

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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