Integrated Driver & MOSFET | FDMF5071

Smart Power Stage (SPS) Modules with Integrated Current and Temperature Monitors

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Overview

The FDMF5071 is ON Semiconductor’s next generation SmartPower Stage (SPS) solution with fully optimized, ultra−compact,integrated MOSFETs with advanced driver IC current and temperaturesensors, for high−current, high frequency, and synchronous buckDC−DC converters.
With an integrated approach, the SPS switching power stage isoptimized for driver and MOSFET dynamic performance, systemparasitic reduction, and power MOSFET RDS(ON).
The integration of Power MOSFETs with a driver IC also enableshigh accuracy module−level thermal and current monitoring. TheFDMF5071 provides an output signal (IMON), which reports thereal−time module current. The IMON signal can be used to replaceinductor DCR current sense or resistor sense methods. There is alsoaccurate thermal monitoring (TMON) that provides a 0.8 V output at25°C with an 8 mV/°C slope.

  • CPU and Memory Voltage Regulators
  • High-Current Multiphase Voltage Regulators
  • DC/DC Power Module

  • Server CPUs, Storage, Telecom
  • Artificial Intelligence Add-On Cards

  • Up to 90A Instantaneous Peak Current Handling Capability
  • High-Performance, Universal Footprint, Copper-Clip 5 mm x 6 mm PQFN Package
  • ON Semiconductor’s PowerTrench® MOSFETs for Clean Voltage Waveforms and Reduced Ringing
  • 30 V / 25 V Breakdown Voltage MOSFETs for Higher Long-Term Reliability
  • Optimized for Switching Frequencies up to 1 MHz
  • Optimized FET Pair for Highest Efficiency at 10% ~ 15 % Duty Cycle
  • Optimized for Switching Frequencies up to 1 MHz
  • Integrated Current Monitoring (IMON)
  • Integrated Temperature Monitor (TMON)
  • Catastrophic Fault Detection Features
  • Thermal Flag (OTP) for Over-Temperature Condition
  • Over-Current Protection Fault (OCP)
  • High-Side Short Detect Fault
  • Under-Voltage Lockout (UVLO) on VCC and PVCC
  • ON Semiconductor Green Packaging and RoHS Compliant

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FDMF5071

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Active

CAD Model

Pb

A

H

P

PQFN-39

483BF

1

260

REEL

3000

N

5

12

3.3V, 5V

90

1

$1.9333

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Reliability Data

Die Related Summary Data

Device: FDMF5071

Equivalent to wafer fab process: 29,RN

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

29,RN

0

129145414

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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