IGBT/MOSFET Gate Drivers Optocouplers | FOD8383

FOD8383 2.5 A Output Current, High-Speed, MOSFET/IGBT Gate Drive Optocoupler in Optoplanar® Wide-Body SOP 5-Pin

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Overview

The FOD8383 is a 2.5 A output current gate drive optocoupler capable of driving medium-power IGBT/MOSFETs. It is ideally suited for fast-switching driving of power IGBT and MOSFET used in motor-control inverter applications and high-performance power systems.
The FOD8383 utilizes onsemi’s Optoplanar® coplanar packaging technology and optimized IC design to achieve reliable high-insulation voltage and high-noise immunity.
It consists of an Aluminum Gallium Arsenide (AlGaAs) Light-Emitting Diode (LED) optically coupled to an integrated circuit with a high-speed driver for push-pull MOSFET output stage. The device is housed in a wide body, 5-pin, small-outline, plastic package.

  • AC-DC Merchant Power Supply
  • Consumer Appliances
  • Industrial Motor

  • Reliable and High-Voltage Insulation with Greater than 10 mm Creepage and Clearance Distance and 0.5 mm Internal Insulation Distance
  • 2.5 A Output Current Driving Capability for Medium-Power IGBT/MOSFET
  • P-Channel MOSFET at Output Stage Enables Output Voltage Swing Close to Supply Rail
  • 35 kV/μs Minimum Common Mode Rejection
  • Wide Supply Voltage Range: 15 V to 30 V
  • Fast Switching Speed Over Full Operating Temperature Range
  • 210 ns Maximum Propagation Delay
  • 65 ns Maximum Pulse-Width Distortion
  • Under-Voltage Lockout (UVLO) with Hysteresis
  • Extended Industrial Temperate Range: -40°C to 100°C
  • Safety and Regulatory Approvals:
  • UL1577, 5,000 VACRMSfor 1 Minute
  • DIN-EN/IEC60747-5-5, 1,414 V Peak Working Insulation Voltage

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IFLH (Max) (mA)

IDDL, IDDH (Max) (mA)

IOL, IOH (Min) (A)

tPHL, tPLH (Max) (ns)

PWD (Max) (ns)

VUVLO (Typ) (V)

VUVLO- (Typ) (V)

CMR (Min) (kV/µs)

VISO (Min) (V)

TOPR (Min) (°C)

TOPR (Max) (°C)

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FOD8383

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CAD Model

Pb

A

H

P

SOIC5 (6) 3.95x9.20x2.55, 1.27P

752AF

1

260

TUBE

2000

Y

7.5

3.5

2.5

210

65

13

11.5

35

5000

-40

100

$2.439

More Details

FOD8383R2

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CAD Model

Pb

A

H

P

SOIC5 (6) 3.95x9.20x2.55, 1.27P

752AF

1

260

REEL

1000

Y

7.5

3.5

2.5

210

65

13

11.5

35

5000

-40

100

$2.439

More Details

FOD8383R2V

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Active

CAD Model

Pb

A

H

P

SOIC5 (6) 3.95x9.20x2.55, 1.27P

752AF

1

260

REEL

1000

Y

7.5

3.5

2.5

210

65

13

11.5

35

5000

-40

100

$2.439

More Details

FOD8383V

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Active

CAD Model

Pb

A

H

P

SOIC5 (6) 3.95x9.20x2.55, 1.27P

752AF

1

260

TUBE

2000

Y

7.5

3.5

2.5

210

65

13

11.5

35

5000

-40

100

$2.439

More Details

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Reliability Data

Die Related Summary Data

Device: FOD8383

Equivalent to wafer fab process: BB,GA

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

BB,GA

0

105155986

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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