IGBT/MOSFET Gate Drivers Optocouplers | FOD8321

2.5A Output Current, Gate Drive Optocoupler in Optoplanar® Wide Body SOP 5-Pin

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Overview

The FOD8321 is a 2.5A Output Current Gate Drive Optocoupler, capable of driving medium power IGBT/MOSFETs. It is ideally suited for fast switching driving of power IGBT and MOSFETs used in motor control inverter applications, and high performance power systems.
It utilizes ON Semiconductor’s coplanar packaging technology, Optoplanar®, and optimized IC design to achieve reliably high insulation voltage and high noise immunity.
It consists of a aluminum gallium arsenide (AlGaAs) light emitting diode optically coupled to an integrated circuit with a high-speed driver for push-pull MOSFET output stage. The device is housed in a wide body 5-pin small outline plastic package.

  • AC and Brushless DC Motor Drives
  • Industrial Inverter
  • Uninterruptible Power Supply
  • Induction Heating
  • Isolated IGBT/Power MOSFET Gate Drive

  • Fairchild’s Optoplanar® packaging technology provides reliable and high voltage insulation with greater than 8mm creepage and clearance distance, and 0.5mm internal insulation distance while still offering a compact footprint
  • 2.5A output current driving capability for medium power IGBT/MOSFET
  • Use of P-Channel MOSFETs at output stage enables output voltage swing close to the supply rail
  • 20kV/µs Minimum Common Mode Rejection
  • Wide Supply Voltage range from 15V to 30V
  • Fast Switching Speed over full operating temperature range
  • 500ns max. propagation delay
  • 300ns max. pulse width distortion
  • Under-Voltage LockOut (UVLO) with hysteresis
  • Extended industrial temperate range, -40 to 100°C temperature range
  • Safety and regulatory approvals
  • UL1577, 5,000VRMS for 1 min.
  • DIN EN/IEC60747-5-5, 1,414V peak working insulation voltage

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IFLH (Max) (mA)

IDDL, IDDH (Max) (mA)

IOL, IOH (Min) (A)

tPHL, tPLH (Max) (ns)

PWD (Max) (ns)

VUVLO (Typ) (V)

VUVLO- (Typ) (V)

CMR (Min) (kV/µs)

VISO (Min) (V)

TOPR (Min) (°C)

TOPR (Max) (°C)

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FOD8321

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CAD Model

Pb

A

H

P

SOIC5 (6) 3.65x8.80x2.55, 1.27P

752AG

1

260

TUBE

2000

Y

7.5

5

2

500

300

12.7

11.2

20

5000

-40

100

$2.4339

More Details

FOD8321R2

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CAD Model

Pb

A

H

P

SOIC5 (6) 3.65x8.80x2.55, 1.27P

752AG

1

260

REEL

1000

Y

7.5

5

2

500

300

12.7

11.2

20

5000

-40

100

$2.5555

More Details

FOD8321R2V

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Active

CAD Model

Pb

A

H

P

SOIC5 (6) 3.65x8.80x2.55, 1.27P

752AG

1

260

REEL

1000

Y

7.5

5

2

500

300

12.7

11.2

20

5000

-40

100

$2.4339

More Details

FOD8321V

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Active

CAD Model

Pb

A

H

P

SOIC5 (6) 3.65x8.80x2.55, 1.27P

752AG

1

260

TUBE

2000

Y

7.5

5

2

500

300

12.7

11.2

20

5000

-40

100

$2.4339

More Details

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Reliability Data

Die Related Summary Data

Device: FOD8321

Equivalent to wafer fab process: BB,GA

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

BB,GA

0

105155986

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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