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FDZ391P: P-Channel 1.5 V PowerTrench® Thin WL-CSP MOSFET -20V, -3A, 85mΩ

Datasheet: FDZ391P-D.pdf
Rev. A (378kB)
Product Overview
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» Product Change Notification
Designed on an advanced 1.5 V PowerTrench process with state of the art "low pitch" Thin WLCSP packaging process, the FDZ391P minimizes both PCB space and RDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low RDS(on).
Features
 
  • Max RDS(on) = 85 mΩ at VGS = -4.5 V, ID = -1 A
  • Max RDS(on) = 123 mΩ at VGS = -2.5 V, ID = -1 A
  • Max RDS(on) = 200 mΩ at VGS = -1.5 V, ID = -1 A
  • Occupies only 1.5 mm2 of PCB area
  • Ultra-thin package: less than 0.4 mm height when mountedto PCB
  • RoHS Compliant
Applications
  • This product is general usage and suitable for many different applications.
  • Battery Management
  • Load Switch
  • Battery Protection
Product
Status
Compliance
Description
Package
MSL
Container
Budgetary Price/Unit
Type
Case Outline
Type
Temperature
Type
Qty.
FDZ391P Last Shipments
Pb-free
Halide free
FDZ391P WLCSP-4 567PT 1 260 Tape and Reel 5000  
Market Leadtime (weeks) : Contact Factory
Case Outlines
567PT   
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