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FDZ197PZ: P-Channel 1.5V Specified PowerTrench® Thin WL-CSP MOSFET -20V, -3.8A, 64mΩ

Datasheet: FDZ197PZ-D.pdf
Rev. A (416kB)
Product Overview
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» Product Change Notification
Designed on an advanced 1.5 V PowerTrench® process with state of the art "fine pitch" WLCSP packaging process, the FDZ197PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
Features
 
  • Max rDS(on) = 64 mΩ at VGS = -4.5 V, ID = -2.0 A
  • Max rDS(on) = 71 mmΩ at VGS = -2.5 V, ID= -2.0 A
  • Max rDS(on) = 79 mmΩ at VGS = -1.8 V, ID = -1.0 A
  • Max rDS(on) = 95 mmΩ at VGS = -1.5 V, ID = -1.0 A
  • Occupies only 1.5 mm2 of PCB area. Less than 50% of thearea of 2 x 2 BGA
  • Ultra-thin package: less than 0.65 mm height when mountedto PCB
  • HBM ESD protection level > 4.4 kV (Note 3)
  • RoHS Compliant
Applications
  • This product is general usage and suitable for many different applications.
  • Battery Management
  • Load Switch
  • Battery Protection
Product
Status
Compliance
Description
Package
MSL
Container
Budgetary Price/Unit
Type
Case Outline
Type
Temperature
Type
Qty.
FDZ197PZ Obsolete
Pb-free
Halide free
FDZ197PZ WLCSP-6 567PW 1 260 Tape and Reel 5000  
Market Leadtime (weeks) : Contact Factory
Case Outlines
567PW   
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