Schottky Diodes & Schottky Rectifiers | NSR01F30NX

100 mA, 30 V, Schottky Barrier Diode

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Overview

The Schottky diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN style package enables 100 percent utilization of the package area for active silicon offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.

  • Buck and Boost DC-DC Converters
  • Reverse Voltage and Current Protection

  • Mobile Handsets
  • MP3 Players
  • Digital Camera & Camcorders

  • Low Forward Voltage Drop
  • Low Reverse Current
  • High Switching Speed

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NSR01F30NXT5G

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CAD Model

Pb

A

H

P

DSN-2

152AA

1

260

DSFTP

5000

Y

Single

30

0.37

7

0.1

4

-

7

$0.0667

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Reliability Data

Die Related Summary Data

Device: NSR01F30NXT5G

Equivalent to wafer fab process: SSD

Product Technology

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Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

SSD

0

6889897810

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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