Low/Medium Voltage MOSFETs | NTMFSC2D9N08H

MOSFET - Power, Single, N-Channel, DUAL COOLTM, DFN8 5x6. 15, 80V, 2.9m, 154A

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Overview

This N-Channel MOSFET is produced using onsemi’s advanced Power Trench® process. Advancements in both silicon and Dual Cool™ package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance by extremely low Junction-to-Ambient thermal resistance.

  • Synchronous Rectification for ATX / Server / Telecom PSU
  • DC−DC Conversion
  • Orring FET/Load Switching/Hot Swap Application
  • Motor Drives and Uninterruptible Power
  • Micro Solar Inverter
  • Battery Management and Protection

  • Power Supplies
  • Motor control
  • Solar Inverters

  • Advanced Dual−Side Cooled Packaging
  • Ultra Low RDS(on) to Minimize Conduction Losses
  • MSL1 Robust Packaging Design
  • Low Qg and Qoss to Minimize Charge Losses
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

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Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Vgs (V)

Vgs(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

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NTMFSC2D9N08H

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CAD Model

Pb

A

H

P

DFN-8

506EG

1

260

REEL

3000

No

N-Channel

PowerTrench® T8

Power 56 Dual Cool

Low-Medium Voltage

Standard

0

Single

0

80

2.9

20

4

154

166

~NA~

~NA~

~NA~

68

4380

~NA~

81

610

16

$1.121

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Reliability Data

Die Related Summary Data

Device: NTMFSC2D9N08H

Equivalent to wafer fab process: TRENCH FET

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

TRENCH FET

10

14928493324

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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