Low/Medium Voltage MOSFETs | FDMB3800N

Dual N-Channel PowerTrench® MOSFET 30V, 4.8A, 40mΩ

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Overview

These N-Channel Logic Level MOSFETs are produced using an advanced PowerTrench process that has been especially tailored to minimize the on-state resistance and yet maintain superior switching performance.
These devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required.

  • This product is general usage and suitable for many different applications.

  • Max rDS(on) = 40mΩ at VGS = 10V, ID = 4.8A
  • Max rDS(on) = 51mΩ at VGS = 4.5V, ID = 4.3A
  • Fast switching speed
  • Low gate Charge
  • High performance trench technology for extremely low rDS(on)
  • High power and current handling capability.
  • RoHS Compliant

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Reliability Data

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Vgs (V)

Vgs(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

FDMB3800N

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CAD Model

Pb

A

H

P

WDFN-8

511CW

1

260

REEL

3000

Y

N-Channel

PowerTrench® T1

Power 33 (u8FL)

Low-Medium Voltage

Logic

0

Dual

0

30

40

20

3

4.8

1.6

-

Q1=Q2=51

-

4

350

-

-

-

-

$0.3307

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Reliability Data

Die Related Summary Data

Device: FDMB3800N

Equivalent to wafer fab process: T2

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

T2

0

1290840276

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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