Low/Medium Voltage MOSFETs | FDMA1023PZ

Dual P-Channel PowerTrench® MOSFET -20V , -3.7A, 72mΩ

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Overview

This device is designed specifically as a single package solution for the battery charge switch in cellular handset and other ultraportable applications. It features two independent P-Channel MOSFETs with low on-state resistance for minimum conduction losses. When connected in the typical common source configuration, bi-directional current flow is possible. The MicroFET 2X2 package offers exceptional thermal performance for its physical size and is well suited to linear mode applications.

  • This product is general usage and suitable for many different applications.

  • Max rDS(on) = 72mΩ at VGS = –4.5V, ID = –3.7A
  • Max rDS(on) = 95mΩ at VGS = –2.5V, ID = –3.2A
  • Max rDS(on) = 130mΩ at VGS = –1.8V, ID = –2.0A
  • Max rDS(on) = 195mΩ at VGS = –1.5V, ID = –1.0A
  • Low profile - 0.8 mm maximum - in the new packageMicroFET 2x2 mm
  • HBM ESD protection level > 2kV typical
  • RoHS Compliant
  • Free from halogenated compounds and antimonyoxides

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Vgs (V)

Vgs(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

FDMA1023PZ

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Active

CAD Model

Pb

A

H

P

WDFN-6

511DA

1

260

REEL

3000

Y

P-Channel

PowerTrench® T1

Power 22

Low-Medium Voltage

Logic

0

Dual

0

-20

-

8

-1

-3.7

1.5

Q1=Q2=95

Q1=Q2=72

3.4

8.6

490

-

-

-

-

$0.2746

More Details

FDMA1023PZ-F106

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Obsolete

Similar Products
CAD Model

Pb

A

H

P

WDFN-6

511DA

1

260

REEL

3000

N

P-Channel

PowerTrench® T1

Power 22

Low-Medium Voltage

Logic

0

Dual

0

-20

-

8

-1

-3.7

1.5

Q1=Q2=95

Q1=Q2=72

3.4

8.6

490

-

-

-

-

Price N/A

More Details

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Reliability Data

Die Related Summary Data

Device: FDMA1023PZ

Equivalent to wafer fab process: TV

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

TV

0

1399545734

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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