Low/Medium Voltage MOSFETs | FDFMA3N109

Integrated N-Channel PowerTrench®MOSFET and Schottky Diode 30 V, 2.9 A, 123 mΩ

Obsolete

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Overview

This device is designed specifically as a single package solution for a boost topology in cellular handset and other ultra-portable applications. It features a MOSFET with low input capacitance, total gate charge and onstate resistance, and an independently connected schottky diode with low forward voltage and reverse leakage current to maximize boost efficiency.
The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to switching and linear mode applications.

  • This product is general usage and suitable for many different applications.

  • 2.9 A, 30 V
  • RDS(ON) = 123 mΩ @ VGS = 4.5 V
  • RDS(ON) = 140 mΩ @ VGS = 3.0 V
  • RDS(ON) = 163 mΩ @ VGS = 2.5
  • VF < 0.46 V @ 500mA
  • Low profile – 0.8 mm maximum – in the new package MicroFET 2x2 mm
  • HBM ESD protection level = 1.8kV typical (Note 3)
  • RoHS Compliant

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Vgs (V)

Vgs(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

FDFMA3N109

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Obsolete

Similar Products
CAD Model

Pb

A

H

P

WDFN-6

511DA

1

260

REEL

3000

N

N-Channel

PowerTrench® T1

Power 22

Low-Medium Voltage

Logic

0

with Schottky Diode

0

30

123

12

1.5

2.9

1.5

-

163

-

2.4

190

-

-

-

-

Price N/A

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Reliability Data

Die Related Summary Data

Device: FDFMA3N109

Equivalent to wafer fab process: RF,TT

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

RF,TT

0

332986487

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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