Low/Medium Voltage MOSFETs | FDD306P

P-Channel 1.8V Specified PowerTrench® MOSFET -12V, -6.7A, 28mΩ

Active

Datasheet

Products

Similar Products

Overview

This P-Channel 1.8V Specified MOSFET uses a advanced low voltage PowerTrench process. It has been optimized for battery power management.

  • This product is general usage and suitable for many different applications.

  • -6.7A, -12V
  • RDS(ON) = 28 mΩ @ VGS = -4.5V
  • RDS(ON) = 41 mΩ @ VGS = -2.5V
  • RDS(ON) = 90 mΩ @ VGS = -1.8V
  • Fast switching speed
  • High performance trench technology for extremelylow RDS(ON)
  • High power and current handling capability

Tools and Resources

Product services, tools and other useful resources related to FDD306P

CAD Model

CAD Model

Material Composition

Product Change Notification

Reliability Data

Product List

Need a Gate Driver?

If you wish to buy products or product samples, please log in to your onsemi account.

Search

Close Search

Products:

1

Share

Sort by

Product Groups:

┗

Orderable Parts:

1

Product

Status

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

Vgs (V)

Vgs(th) Max (V)

ID Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

Reference Price

FDD306P

Loading...

Active

CAD Model

Pb

A

H

P

DPAK-3 / TO-252-3

369AS

1

260

REEL

2500

N

P-Channel

PowerTrench® T1

DPAK

Low-Medium Voltage

Logic

0

Single

0

-12

-

8

-1.5

-6.7

52

41

28

-

15

1290

-

-

-

-

$0.3823

More Details

Show More

1-25 of 25

Products per page

Jump to :

1
contact sales icon

Support on the go

Find and compare products, get support and connect with onsemi sales team.

Reliability Data

Die Related Summary Data

Device: FDD306P

Equivalent to wafer fab process: TT

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

TT

6

2104831460

More Details

Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

New Search