Extremefast (EF) diode, 650 V, 300 A Bare Die with Solderable Top Metal. Pairing with PCGA300T65DF8M1

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Overview

This 650V Extremefast (EF) diode Bare Die has a die size of 10mm x 7.2mm. Its anode pad (top side) is covered with Ni/Ag solderable top metal, which enables advanced power module assembly technologies for top side connection, including Ag Sintering and Cu bare soldering, etc.

  • Automotive Traction Modules
  • General Power Modules
  • xEV
  • AEC-Q101 Qualified
  • Maximum Junction Temperature 175°C
  • Low Forward Voltage (VF = 1.2 V (Typ.) @ IF = 300 A)
  • Extremefast Technology with soft recovery
  • Final Solderable Metal Layer

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