IGBT 650 V, 300 A Field Stop Trench Gen3 (FS3) Bare Die with Solderable/Sinterable Top Metal. Pairing with PCRKA30065F8M1

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Overview

This 650V Field Stop Trench Gen3 (FS3) IGBT bare die has a die size of 12mm x 12mm. Its emitter pads are covered with Ni/Ag solderable/sinterable top metal, which enables advanced power module assembly technologies for emittering connection, including Ag Sintering and Cu bare soldering, etc.

  • Automotive Traction modules
  • General Power Modules
  • xEV
  • AEC−Q101 Qualified
  • Maximum Junction Temperature 175°C
  • Positive Temperature Coefficient
  • Integrated Current Sensor
  • Integrated Temperature Sensor
  • Short Circuit Rated
  • Very Low Saturation Voltage: VCE(SAT) = 1.5 V(Typ.) @ IC = 300 A

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V(BR)CES Typ (V)

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Co-Packaged Diode

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PCGA300T65DF8M1

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CAD Model

Pb

A

H

P

-

-

NA

0

MTFRM

1

N

-

650

300

1.25

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-

-

-

-

-

5

-

-

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$10.0317

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