IGBTs | PCGA300T65DF8M1

IGBT 650 V, 300 A Field Stop Trench Gen3 (FS3) Bare Die with Solderable/Sinterable Top Metal. Pairing with PCRKA30065F8M1

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Overview

This 650V Field Stop Trench Gen3 (FS3) IGBT bare die has a die size of 12mm x 12mm. Its emitter pads are covered with Ni/Ag solderable/sinterable top metal, which enables advanced power module assembly technologies for emittering connection, including Ag Sintering and Cu bare soldering, etc.

  • Automotive Traction modules
  • General Power Modules
  • xEV
  • AEC−Q101 Qualified
  • Maximum Junction Temperature 175°C
  • Positive Temperature Coefficient
  • Integrated Current Sensor
  • Integrated Temperature Sensor
  • Short Circuit Rated
  • Very Low Saturation Voltage: VCE(SAT) = 1.5 V(Typ.) @ IC = 300 A

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

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ON Target

V(BR)CES Typ (V)

IC Max (A)

VCE(sat) Typ (V)

VF Typ (V)

Eoff Typ (mJ)

Eon Typ (mJ)

Trr Typ (ns)

Irr Typ (A)

Gate Charge Typ (nC)

Short Circuit Withstand (µs)

EAS Typ (mJ)

PD Max (W)

Co-Packaged Diode

Pricing ($/Unit)

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PCGA300T65DF8M1

Active

Pb

A

H

P

-

-

NA

0

MTFRM

1

N

650

300

1.25

-

-

-

-

-

-

5

-

-

-

$10.0317

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