KB: Device Packages & Material Composition of RSL10

[RSL10 - Knowledge Base]

RSL10 Packages & Drawings

Each of the available RSL10 packages caters to a different use-case or design need that is seen during product development. This means that the Ultra Low-Power Bluetooth Low Energy experience offered by the RSL10 can be seamlessly integrated into a large variety of existing application and products, or developed on its own to create a fully functional standalone device with a flexible form factor. A few benefits of each package are outlined briefly below, along with a link to the respective drawings.

Talk to your local sales contact for more details on ordering the package that is right for your application.


  • Fully integrated system including antenna and passive components
  • Larger package due to pre-selected and integrated component choices
  • Easiest and quickest package to develop or integrate, minimizing design effort
  • Recommended PCB Design Guidelines are provided

SiP Drawings


  • Simplest PCB design and lead breakout
  • Smaller package than SiP but requires external components needed
  • Greater flexibility in component placement
  • Larger package than WLCSP but wafer is already encapsulated
  • Larger pitch than WLCSP

QFN Drawings

Automotive QFN

  • Same benefits as standard QFN but slightly larger
  • Highest operating temperature tolerance to meet industry needs
  • Leads designed to be installed alongside automotive manufacturing processes

Automotive QFN Drawings


  • Most complex PCB design and lead breakout
  • Smallest package available, external components needed
  • Most effort required to develop/design

WLCSP Drawings

RSL10 Package Dimensions

Package Length (mm) Width (mm) Height (mm)
SiP 6 8 1.36 - 1.56
QFN 6 6 0.8 - 1.0
Automotive QFN 7 7 0.8 - 0.9
WLCSP 2.325 2.364 0.319 - 0.381

RSL10 Material Composition

Each of the RSL10 Packages discussed above also has a corresponding Material Composition estimate, offered in terms of % of total package weight. These materials and estimated values vary depending on the package, which can be attributed to physical properties, such as:

  • the integration of system components like an antenna
  • the use or lack of different types of wire leads
  • the epoxy encapsulation method/present

List of Packages and their Material Compositions

Hi Brandon,

Just wonder if you could share any PCB layout guidelines/documents for WLCSP package?


Hi @OS_com,

A PCB Design Guidelines section can be found within the RSL10 Datasheet on page 10.

Please let us know if this is sufficient information, and thank you for using our Community Forums!

Hi Brandon,

 Thank for information.

I could refer to RSL100-USB001GEVK_GERBER for PCB layout guidance of QFN package. Hence, It would be great if you could offer gerber files for WLCSP package of which has been implemented in your reference design.



Please note that the WLCSP EVB is discontinued and no longer available or supported. We do share the Gerber files ‘as-is’ as a sample layout.

WLCSP51_CASE567MT.zip (3.4 KB)

Hi @martin.bela

In the Gerbers you have shared, the solder mask is almost non-existent between the pads due to the large stop mask circles. Is this the recommended footprint? Will there be issues like solder bridges or solder lost to pad connected traces due to the lack of solder mask? Do you have any other Gerbers that you could share (like the SIP board) that demonstrates how best to route to the NSMD pads?