.SUBCKT FDMC8030 2 1 3 ****************************************************************** ** Fairchild Discrete Modeling Group ** ****************************************************************** ** Website www.fairchildsemi.com\models ** ****************************************************************** ** (C) Copyright 2009 Fairchild Semiconductor Corporation ** ** All rights reserved ** ** ** ** FDMC8030 Spice model ** ** Revision RevB, November15 2011 ** ****************************************************************** *Nom Temp 25 deg C Dbody 7 5 DbodyMOD Dbreak 5 11 DbreakMOD Lgate 1 9 0.578e-9 Ldrain 2 5 0.006e-9 Lsource 3 7 0.121e-9 RLgate 1 9 5.78 RLdrain 2 5 0.06 RLsource 3 7 1.21 Rgate 9 6 2.28 * Shielded Gate D_D1 100 5 D_SG_cap D_D2 100 101 D_SG_cap R_R1 101 7 6.44 C_C1 6 101 200e-12 .MODEL D_SG_cap D (IS=1e-9 n=1 RS=5e-3 CJO=1.45e-9 M=0.6 t_abs=25);14.4e-9 It 7 17 1 Ebreak 11 7 17 7 44 Rbreak 17 7 RbreakMOD 1 .MODEL RbreakMOD RES (TC1=0.65e-3 TC2=-1e-6) .MODEL DbodyMOD D (IS=4.2e-12 n=1 RS=4.573e-3 TRS1=4.9e-3 TRS2=1e-6 + CJO=0.13e-9 M=0.1 TT=3e-9 XTI=1) .MODEL DbreakMOD D (RS=30e-3 TRS1=1e-3 TRS2=1e-6 ) Rsource 7a 7 0.916e-3 Rdrain 5 16 RdrainMOD 4.876e-3 .MODEL RdrainMOD RES (TC1=10e-3 TC2=20e-6) M_BSIM3 16 6 7a 7a Bsim3 W=2.12 L=0.624e-6 NRS=0 NRD=0 .MODEL Bsim3 NMOS (LEVEL=7 VERSION=3.1 MOBMOD=3 CAPMOD=2 paramchk=1 NQSMOD=0 *Process Parameters + TOX=500e-10 ;Oxide thickness + XJ=0.22e-6 ;Channel depth + NCH=1.4e17 ;Channel concentration *Channel Current + U0=600 VSAT=500000 DROUT=1.2 + DELTA=0.05 PSCBE2=0 RSH=0.916e-3 *Threshold voltage + VTH0=1.7 *Sub-threshold characteristics + VOFF=-0.1 NFACTOR=1.1 *Junction diodes and Capacitance + LINT=0.11e-6 DLC=0.11e-6 + CGSO=360e-12 CGSL=0 CGDO=1e-12 CGDL=190e-12 + CJ=0 CF=0 CKAPPA=0.3 * Temperature parameters + KT1=-1.1 KT2=0 UA1=6e-9 + NJ=10) .ENDS *