.SUBCKT FDMC7660S 2 1 3 ****************************************************************** ** Fairchild Discrete Modeling Group ** ****************************************************************** ** Website www.fairchildsemi.com\models ** ****************************************************************** ** (C) Copyright 2009 Fairchild Semiconductor Corporation ** ** All rights reserved ** ** ** ** FDMC7660S Spice model ** ** Revision RevA, 23 Feb 2010 ** ****************************************************************** *Nom Temp 25 deg C Dbody 7 5 DbodyMOD Dschottky 7 5 DSchottkyMOD Dbreak 5 11 DbreakMOD Lgate 1 9 0.517e-9 Ldrain 2 5 0.005e-9 Lsource 3 7 0.09e-9 RLgate 1 9 5.17 RLdrain 2 5 0.05 RLsource 3 7 0.9 Rgate 9 6 0.71 * Shielded Gate D_D1 100 5 D_SG_cap D_D2 100 101 D_SG_cap R_R1 101 7 1.29 C_C1 6 101 197e-12 .MODEL D_SG_cap D (IS=1e-9 n=1 RS=4e-3 CJO=4.5e-9 M=0.6 t_abs=25) It 7 17 1 Ebreak 11 7 17 7 33 Rbreak 17 7 RbreakMOD 1 .MODEL RbreakMOD RES (TC1=0.5e-3 TC2=-1e-6) .MODEL DbodyMOD D (IS=13.382e-12 n=1.04 RS=0.95e-3 TRS1=1.5e-3 TRS2=1e-6 + CJO=0.47e-9 M=0.34 TT=3e-9 XTI=1) .MODEL DSchottkyMOD D (IS=4.194e-6 n=1 RS=45e-3 TRS1=1.5e-3 TRS2=1e-6 + CJO=0.47e-9 M=0.34 TT=3e-9 XTI=-18) .MODEL DbreakMOD D (RS=30e-3 TRS1=1e-3 TRS2=1e-6 ) Rsource 7a 7 0.236e-3 Rdrain 5 16 RdrainMOD 1.22e-3 .MODEL RdrainMOD RES (TC1=3.5e-3 TC2=10.5e-6) M_BSIM3 16 6 7a 7a Bsim3 W=7.05 L=1.22e-6 NRS=0 NRD=0 .MODEL Bsim3 NMOS (LEVEL=7 VERSION=3.1 MOBMOD=3 CAPMOD=2 paramchk=1 NQSMOD=0 *Process Parameters + TOX=500e-10 ;Oxide thickness + XJ=0.16e-6 ;Channel depth + NCH=1.9e17 ;Channel concentration *Channel Current + U0=1250 VSAT=500000 DROUT=1.2 + DELTA=0.4 PSCBE2=0.00001 RSH=0.236e-3 *Threshold voltage + VTH0=1.22 *Sub-threshold characteristics + VOFF=-0.1 NFACTOR=1.1 *Junction diodes and Capacitance + LINT=0.375e-6 DLC=0.375e-6 + CGSO=112e-12 CGSL=10e-12 CGDO=8.5e-12 CGDL=170e-12 + CJ=0 CF=0 CKAPPA=0.15 * Temperature parameters + KT1=-1.1 KT2=0 UA1=2.5e-10; UA1=3e-9 + NJ=10) .ENDS