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Package Drawings for  Thermal Management (Show All)

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Document Title
Document ID/Size
Revision
48 LEAD LQFP, 7X7, 0.5P 932AA (69kB) A
C/O FOR MICRO 10 PKG 846B (30.6kB) D
DFN8 2.0x2.0x0.9mm, 0.5p 506AA (43kB) F
DFN8 3x3, 0.5P 506BJ (43kB) O
LFCSP32, 5x5, 0.5P 932AE (44kB) A
Micro8 Surface Mount 846A-02 (56kB) K
QSOP-16 492-01 (55kB) A
QSOP24 NB 492B-01 (57kB) a
SOIC-8 Narrow Body 751-07 (53kB) AK
TSSOP24 7.8x4.4, 0.65P 948H-01 (50kB) B
WDFN8 2x1.8, 0.5P 511BU (46kB) O
WDFN8 2x2, 0.5P 511AT (46kB) O
WLCSP8, 1.155x1.655 567DH (41kB) O
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