PHOENIX, Ariz. – Nov. 20, 2003 – To improve efficiency in the manufacturing of advanced devices worldwide, ON Semiconductor (Nasdaq: ONNN) today announced its plans to consolidate more of its assembly and test operations at its site in Seremban, Malaysia.
As part of this consolidation, the company will discontinue back-end manufacturing at its site in Roznov, Czech Republic and move its back-end manufacturing equipment to Seremban. ON Semiconductor plans to maintain its front-end manufacturing and design center operations at the Roznov site where it has significant ties to technical universities in the Czech Republic and Slovakia.
By consolidating more of its assembly and test operations at key sites around the world, ON Semiconductor plans to drive world-class quality and cost for its customers. The company’s 281,000 square-foot, assembly and test facility in Seremban, Malaysia currently employs 2,150 workers and conducts the assembly and test for more than 5 billion of the 20 billion devices that the company manufactures annually.
In Roznov, the move affects roughly 450 employees. The company plans to transition some of these positions into its front-end and design operations that are located at the site. The consolidation also enables the facility in Roznov to focus on its strengths in design and tech-intensive, front-end manufacturing, and provides the company with the potential to introduce more advanced technologies to the site as market conditions evolve.
About ON Semiconductor
ON Semiconductor (Nasdaq: ONNN) offers an extensive portfolio of power and data management semiconductors and standard semiconductor components that address the design needs of today’s sophisticated electronic products, appliances and automobiles. For more information visit ON Semiconductor’s website at https://www.onsemi.com.
# # #
ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its website in this news release, such information on the website is not to be incorporated herein.