PHOENIX, Ariz. – 9 April, 2018 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced the first CMOS image sensors to feature its Near Infra-Red+ (NIR+) technology, which effectively combines High Dynamic Range (HDR) with enhanced low light performance to enable high-end security and surveillance cameras.
The AR0522 is a 1/2.5-inch 5.1 Megapixel (MP) image sensor based on a 2.2 micrometer (μm) Back Side Illuminated (BSI) pixel technology platform, developed for industrial applications that require high resolution, high quality video capture in low light conditions. The AR0522 image sensor delivers approximately twice the sensitivity in the near Infra-Red wavelength of the existing AR0521 image sensor.
The AR0431 is a 1/3.2-inch 4 MP sensor based on a 2.0 μm BSI pixel technology platform. Offering versatile low power modes and a frame rate of up to 120 fps, it is perfect for applications where slow motion video capture is required. Its low operating power makes it ideal for battery-powered security cameras, as well as action/sports cameras, in-car DVRs and general surveillance cameras.
ON Semiconductor has developed NIR+ technology to increase the Quantum Efficiency (QE) of the sensors in the near Infra-Red region without sacrificing color fidelity in the visible spectrum. Through this technique, security cameras can use fewer IR LEDs on BOM driven at lower voltages and still achieve high quality images in low light and NIR conditions.
Gianluca Colli, Vice President and General Manager, Consumer Solution Division of Image Sensor Group at ON Semiconductor said: “Our NIR+ technology and the back-side illuminated pixel platforms utilized in the AR0522 and AR0431 really come together to deliver outstanding image quality and low-light performance, resulting in brighter and sharper images even in challenging lighting conditions.”
The AR0522 engineering samples are available now in a 12 mm X 12 mm mPLCC package, with mass production planned for May 2018.
Engineering samples of the AR0431 will be available later in April 2018 in a 10 mm x 10 mm mPLCC package, with mass production starting in July 2018.