Product Change Notification
| Change Notification # |
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20461 |
| Revision |
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| Type of Notification |
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qual of OSV for Assy-Test of Trench IGBT and Case outline transition for TO247 |
| Issue Date |
|
2014-04-28 |
| Affected Product Family |
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| Description |
|
This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test operations of TO247 packaged rectifiers and trench IGBTs. Currently, assembly and test of these devices is performed at Nantong Fujitsu Microelectronics (NMFE), China. ON Semiconductor Vietnam (OSV) is being added as an additional assembly and test site.
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| Key Items Affected by Change |
|
ON Semiconductor Assembly & Test |
| |
| Key Milestones |
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| Effective Date: |
|
2014-07-28 |
| Sample Info: |
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| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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