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Product Change Notification

Change Notification #   20461
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Qual of OSV for Assy-Test of Trench IGBT and Case outline transition for TO247
Issue Date   2014-04-28
Affected Product Family  
Description   This FPCN announces the planned capacity expansion of ON Semiconductor’s assembly and test operations of TO247 packaged rectifiers and trench IGBTs. Currently, assembly and test of these devices is performed at Nantong Fujitsu Microelectronics (NMFE), China. ON Semiconductor Vietnam (OSV) is being added as an additional assembly and test site.
Key Items Affected by Change   ON Semiconductor Assembly & Test
 
Key Milestones  
Effective Date:   2014-07-28
Sample Info:  
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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