Product Change Notification
| Change Notification # |
|
20283 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
NCP330 & NCP340 Cu Wire Qualification at ON Semiconductor, Seremban, Malaysia facility. |
| Issue Date |
|
2013-10-30 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is pleased to announce the completion of Cu Wire qualification for the NCP330MUTBG and NCP340MUTBG at ON Semiconductor’s Seremban, Malaysia facility.
The NCP330 & NCP340 are currently assembled at the ON Semiconductor Seremban, Malaysia facility with Au Wire. At the expiration of this PCN, these devices will be built with Cu Wire at the same site.
There is no change in package outline or electrical performance of the parts – they continue to fully meet datasheet specifications.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2014-01-30 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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|