feedback
Rate this webpage

Need
Support?


Product Change Notification

Change Notification #   20082
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Copper wire bond for IC Micro 8 package
Issue Date   2013-05-08
Affected Product Family  
Description   This FPCN is to notify customers of the planned qualification of Copper Wire (in place of Gold Wire) on the Micro 8 packages assembled at the Seremban, Malaysia assembly location. Reliability Qualification and full electrical characterization has now been completed on the designated package qualification vehicles.
Key Items Affected by Change   Assembly Process - Package
 
Key Milestones  
Effective Date:   2013-08-09
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

Previously Viewed Products
Clear List

Technical Support
   
 

Sign Up for Ongoing PCN Updates!
  ON Semiconductor has partnered with PCNAlert to provide product change and product update notification. This service will automatically notify you of time critical product change and obsolescence information. You can customize your preferences, so you only receive PCNs for products you specify.

This is a complimentary service from ON Semiconductor and PCNAlert.