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Product Change Notification

Change Notification #   16710
Revision  
Type of Notification   FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Copper wire bond for Micro 8 package in Seremban, Malaysia
Issue Date   2011-09-01
Affected Product Family  
Description   A General Announcement (GA#16200) was published on 1-29-09 regarding the ongoing Copper Wire bond conversion program at ON Semiconductor. This is a FPCN to notify customers of its plan to qualify Copper Wire (in place of Gold Wire) on the Micro 8 packages assembled at the Seremban, Malaysia assembly location. Reliability Qualification and full electrical characterization over temperature has now been completed on the designated package qualification vehicles.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2011-12-05
Sample Info:   Contact your local ON Semiconductor Sales Office or
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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